IoSense Spring School’19

The slides of the Spring School can be found here (ask for password from or
The news-entry with some photos can be found here.

The Second IoSense Spring School will be held at TU Delft on March 7′ 2019. Technical talks will focus on the innovations and technologies achieved during the project. Talks will be accompanied by demo presentations that will show how the technologies, developed within the IoSense project, can be used in real life application areas.

Objectives and Scope

Focus of the IoSense project is to develop innovative, competitive, next-generation sensors and sensor systems “Made in Europe” to provide solutions for the Internet of Things: LiDAR, sound, pressure, multi-Gases, fine dust, 3D time-of-flight, spectrometer, magnetics, temperature. To Demonstrate the use of the developed sensor technologies several demonstrators focusing on different IoT applications areas have been defined. They cover applications in the domain of Smart Mobility, Society, Energy, Health and Production as well as major Smart Systems Integration aspects like security and trustworthiness.

This Spring School will focus on providing useful insights to the sensor technologies developed and will also provide the technical insights on how the developed technologies are used in real life by displaying demonstrators of different IoT areas

Target Audiences

PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies.

Our talks and demonstrators consist of high-level overview, especially aimed at the hobbyists and technology scouts, while also going into depth for PhD students. Nevertheless, all speakers and participants will be available for your questions during the breaks.

Organizational Details


  • 08:30 Registration
  • 08:45 Welcome
  • 09:00 Key note Session
    • Development of an Integrated Relative Humidity Sensor in the Framework of the IoSense Project, Frederik Vanhelmont, AMS, Netherlands
    • Sensor Integration Developments at TU-Delft, Sten Vollebregt, TU Delft, Netherlands
    • Prognostics & Health Management for LED-based Applications, Willem Van Driel, Phillips, Netherlands
  • 10:30 Talk Session 1
    • Time-of-Flight 3D Imaging and its Field of Applications, Norbert Druml, Infineon Technologies AG Austria
  • 11:00 Demo Session 1
    • TrustWorSys: Secured Smart Production Reinhard Kloibhofer, Austrian Institute of Technology, Austria
  • 11:20 Coffee break
  • 11:40 Talk Session 2
    • Security Concepts Applied in the TrustWorSys Demonstrator, Thomas Ulz, TU Graz, Austria
  • 12:10 Demo Session 2
    • AdCon: Value of IoT Sensors in Energy Efficient Buildings, Prof. Christian Heschl, Fachhochschule Burgenland, Austria
    • Smability: Reliable V2X communication, Jose Cordero, Cristina Rodiguez,Integrasys, Spain
    • Parking assistance based on ToF camera, Enrique David MartiTecnalia, Spain
  • 12:50 Lunch
  • 13:50 Talk Session 3
    • A Software Toolkit for Complex Sensor Systems in Fog Environments, Thang Phan, TU Dresden, Germany
  • 14:20 Demo Session 3
    • HiThRaSpect: High Throughput Raman Spectrometer —Harrie Tilmanns, IMEC, Belgium
    • R-ICU: Reconfigurable Instrument Control Unit use-case: Mars Exploration Rovers Marcos Martinez, Thales Alenia Space, Spain
  • 15:00 Poster Session
    • Real-time Dynamic Local Map (DLM) generation for driving assistance using only LiDAR data. Application to a co-simulation traffic scenario, Fernando Castano Romero, CSIC, Spain
    • Smability demonstrator (Automated Parking),Murgoitio Larrauri, Jesus, Tecnalia, Spain
    • Prognostics & Health Management for LED-based Applications, Willem Van Driel, Phillips, Netherlands
    • AdCon: Value of IoT Sensors in Energy Efficient Buildings, Prof. Christian Heschl, Fachhochschule Burgenland, Austria

KeyNote Session:

Sensor integration developments at TU-Delft

Kouchi Zhang, TU Delft, Netherlands

The research addresses compact and complex system integration and reliability. The major research activities are 3D wafer level integration; advanced packaging level integration (SiP); control and interface engineering of complex systems; design for component, product and complex system reliability; fast reliability qualification and testing. As one of the leading research groups for system integration, our group develops generic technologies for micro/nanoelectronics systems. In the presentation we will give an overview of the past and future work and our view on the relevance to the semiconductor industry.

Prognostics & Health Management for LED-based Applications

Prof. Willem Van Driel, Philips, Netherlands

Philips Lighting’s revenue is largely influenced by the change from component supply to systems, solutions and services. Reliable products start with understanding the physics-of-failure by using accelerated test approaches such as (H)ALT. Classical reliability approaches using such test approaches combined with failure analysis are used in order to obtain conservative bounds from the failure models and predict failure rates on a system level. A next step is to use data analytics on our installed base and here one could actively retract (working) products from the market, analyze them and determine there (degraded) performance. This allows us to move into the prognostics (PHM) regime where a detailed understanding of failure mechanisms, usage scenarios, technology and design come together. In the presentation we show our road towards prognostics and demonstrate PHM work being done in the different professional Lighting application segments: Public Lighting, Office & Industry Lighting and Retail Lighting.


Time-of-Flight 3D imaging and its field of applications

Norbert Druml, Infineon Technologies AG, Austria

Time-of-Flight is a widely used depth perception technology. Typically, infrared light is emitted by a LED or laser and the time until the light is reflected from the scenery is measured. There are direct and indirect measurement principles. The indirect approach evaluates the distance by means of the phase shift between the emitted and received signals with the help of photonic mixing devices (PMD). If integrated together with a strong illumination unit, such Time-of-Flight cameras can perform range measurements of up to 50m. Recently, these PMD-based solutions became quite famous thanks to miniaturization improvements and their low computational performance requirements, which enabled the integration into small embedded devices such as smart phones. In this talk, the basic working principle of Time-of-Flight 3D imaging will be presented. Furthermore, the latest and most promising fields of applications (such as secured face-unlocking) will be shown.

A Software Toolkit for Complex Sensor Systems in Fog Environments

Thang Phan, Technische Universität Dresden, Germany

Recently, Internet of Things (IoT) is becoming an important factor of our daily life. The rapid increase of IoT devices requires an IoT system which has ability to connect the various devices in different locations, process a huge amount of data with low latency. A new concept, known as fog computing, is emerging to offer a great opportunity to deploy such system. How to create IoT applications in fog computing is a challenge with developers, because it requires dealing with heterogeneous sensors/IoT devices and system architecture. In this talk, we present a software toolkit to facilitate developing complex sensor applications in fog computing. Our solution supports modular application architecture and employ docker, a containerized virtualization, for deployment. Therefore, the flexibility of the system is consolidated. Our toolkit abstracts low-level details and provides tools to simplify application implementation. Through use-case demonstrations, we illustrate the potential of our toolkit.

Security concepts applied in the TrustWorSys demonstrator

Thomas Ulz, TU Graz, Austria

Abstract of talk: “The number of sensor-equipped devices, such as sensor nodes, Internet of Things (IoT) devices, and smartphones, is steadily increasing. These devices utilize their sensors to assist us in many everyday tasks by providing useful context-aware functionality. However, recent incidents have shown that such devices can also be used by adversaries to perform malicious activities, such as spying on users or even for industrial espionage. In this talk, I am going to present security weaknesses and subsequent threats due to unprotected configuration interfaces of sensor-equipped devices. After that, countermeasures that facilitate the secured configuration of devices during their entire lifecycle are presented.”


TrustWorSys:Secured Smart Production

Reinhard Kloibhofer, Austrian Institute of Technology, Austria

Industry 4.0 is the engineering philosophy of a modern, automated manufacturing process. The production is based on a smart cooperation of robots and humans and a seamless integration of the Information Technology (IT) and the Operation Technology (OT). A high number of wired and wireless sensors together with modern production machines form a new factory concept where the production information is not only stored in a central server but distributed over different components.

A data-driven product life cycle always starts with a concept idea, proceeds with conducting design, production, testing, marketing and selling activities, and finish with decommissioning of the product. These days, the control of the production cycle is typically centralized. On the other hand, in Industry 4.0 many components of the factory are smart robots that are basically guided from the product itself and not from a central computer. The raw product sends commands to robots and machinery about the necessary steps to take order to produce the desired final product.

In this demonstrator we show the concept of a smart factory with a mobile robot operating with secured product configuration and secured data communication. All production data is stored as a digital copy, named “digital twin”.

AdCon: Value of IoT Sensors in Energy Efficient Buildings

Prof. Christian Heschl, Fachhochschule Burgenland, Austria

The increasing decentralised energy supply with PV and wind power plants necessitate enhanced demand side flexibilities with intelligent communication between energy consumer and provider. In this context, smart buildings in smart grids are designated key enablers to align the energy demand with the volatile energy production for grid stabilization. However, due to the constricted construction timelines, the economic viability pressure and the higher complexity of such integrated energy systems, risk of unnoticed control errors arises. In particular, HVAC systems are difficult to analyse during actual operating phase as a result of the dynamic load behaviour and the individual occupancy requirements. Hence, this presentation details an Open Platform Communication (OPC) / Building Automation and Control Network (BACnet) system which has been developed to combine data from a resident building automation system within the Living Lab ENERGETIKUM and data from IoT wireless sensor networks installed therein. The IoT sensors are deployed to extract the missing key data, which offer additional diagnostic information about building protection aspects and the performance of HVAC components. The skimmed diagnostic data is designed to be fed into Building Information Modelling (BIM) and Computer Added Facility Management (CAFM) tools. This aids in automated fault detection and system optimization during the construction and utilization phase of buildings.

Smability: Reliable V2X Communication

José M. Sánchez, Integrasys, Spain

Autonomous vehicles which are driving in different contexts like highways, urban environments, and rural areas, managing the quality for the entire data processing chain of sensor- and actuator-based autonomous systems is increasingly complex. Because the communication platform is responsible for all the information exchanges, system performance largely depends on communication reliability. Although wireless communication standard considered to be a promising for enhancing transportation safety and efficiency, IEEE 802.11p and ITS-G5 Vehicle to Vehicle (V2V) communication is still unreliable because of the complicating factors of high vehicle speed and harsh radio environments. Performance is still unreliable because of its sensitivity to shadow fading in complex and changeable real-world environment due to its high working frequency and customized physical layer settings. The presentation focused on affordable  planning and testing of reliable V2X communication network based on platform with real vehicles and simulators.

SeFuProTec: Sensor aided manufacturing processes for sensor assembly

Dr. Jens Müller, XENON, Germany

Due to factors such as miniaturization of products, increased cycle time and process precision existing process technologies in electronics, assembly and manufacturing need distinctly increased usage of implemented sensors to meet future requirements. This requires integrating and characterizing sensor functions for process technologies and using multiple types of sensors such as temperature, pressure/vacuum, mass, optical detection, force. In this presentation, we will demonstrate the integration of sensors in high precision crimping processes and sensor aided dispensing.

High Throughput Raman Spectrometer — HiThRaSpect

Harrie Tilmanns, IMEC, Belgium

The HiThRaSpec demonstrator aims at a state of the art demonstration of an integrated Raman spectrometer which can be used in a diverse set of speciation analysis applications. The conceptual build-up of the high throughput Raman spectrometer is described and its principle of operation is explained. The spectrometer is classified as a (spatially) Fourier Transform Spectrometer and does not contain any moving parts. The heart of the instrument is the photonics-based spectrometer chip, monolithically integrated with the image sensor (used for the detection). The basic photonics process flow, implemented as a post processing module on top of e.g. CMOS image sensors, is described. The spectrometer chip is complemented with discrete optics (e.g., specifically designed collection optics) and readout electronics to define the Raman instrument. Examples of Raman measurements for various samples/species using a laboratory prototype are presented, clearly showing the device functionality.


Costs: Zero

For registration write an email to:


Address: Feldmannweg 17, 2628 CT Delft, The Netherlands

Building: TU Delft – Building EWI (36)

Room: EKL Colloquium room – EKL 01.180 (1st floor)

Directions: to reach TU Delft from train station, from air port and to EWI building can be found here:


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