IoSense Spring School 2018

The Spring School is over – see you next year at Delft, The Netherlands.
The news-entry with some photos can be found here.
The slides can be found here.
The talks can be found here.

IoSense will host a Spring School as part of SSI 2018 on April 11th in Dresden. Technical lectures will present the first results and provide an outlook on the technologies researched in the project. We have great talks in a beautiful city.

IoSense Spring School at SSI 2018

Demonstrators for the Internet of Sensors

The Spring School of the JU ECSEL project IoSense demonstrates how to engineer innovative products in sensor-actuator networks. The IoSense project focuses on the availability of top innovative, competitive sensors and sensor systems ”Made in Europe” for ”Internet of Sensor” applications in smart mobility, society, energy, health care and production.

Participants are enabled to build platforms and complements for hardware- software ecosystems so that their future applications in the Internet of Sensors become reality. The IoSense Spring School presents newest sensor technologies as well as ways how to create innovations with them, extending the value chain with easy-to-build software for sensor applications.

Objectives and Scope

The target of the IoSense Spring School is to show how to engineer innovative products. The goal is to enable IoT ecosystems based on hardware/software platforms and complementing applications for flexible and high-performance data aggregation and processing in sensor-actuator networks.

Participants are enabled to build platforms and complements for hardware-software ecosystems so that their future applications in the Internet of Sensors become reality. The IoSense spring school presents newest sensor technologies as well as ways to create innovations with them, extending the value chain with easy-to-build software for sensor applications.

The future technology of IoSense covers

  • Innovative sensor and multi-sensor technologies for heterogeneous application areas
  • Highlighting new approaches for developing sensors using flexible frontend and backend pilot lines
  • Design of sensor and application components for market needs by involving customers early in the development process
  • Enabling external parties to build IoT ecosystems with IoSense technology
  • Closing the gap between chip manufacturers and application developers for transforming existing value chain approaches

Presenting the IoSense Technology Demonstrators

IoSense targets multiple key application areas to help tackle grand societal challenges of our and future generations. Sensor and app-based innovations in areas such as Smart Mobility, Society, Energy, Health and Production, benefit directly from smart, sensor-based systems that communicate among themselves, their environment and offer their services to users. A necessity for smart objects and machines are suitable sensors that are intelligently integrated into future products.

IoSense contributions and solutions are realized in different demonstrators, targeting specific application areas.

During the Spring School selected demonstrators provides an overview about the goal and the addressed key application areas. Components are presented from project experts. Hands-on sessions will focus on integrating sensor components into a software toolbox to showcase the easy-to-use approach on how to build sensor-based applications. The software toolbox is complemented by illustrating the integration of a lean startup inspired process for developing customer-centric products and applications.

Targeted participants
PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies.

Organization Details


The Smart Systems Integration 2018 is a two day event. The IoSense Spring School will be held on April 11, 2018 and consists of a full day program.

08:00 Registration

09:00 Keynote session of Smart Systems Integration

10:40 Coffee Break

11:05 Keynote Dr. Oliver Pyper, Infineon Technologies Dresden and Project Coordinator IoSense “Sensing the world for IoT”

11:35 Talks Session 1

12:45 Lunch

13:45 Talks Session 2

15:25 Coffee break

15:55 Talks Session 3

16:40 Workshop session on IoT Ecosystems – Customer Centric Lean Innovation Process — Prof. Dr. Uwe Aßmann & Carl Mai – Technische Universität Dresden

17:40 Closing notes

Session 1:

  • IoT from the Perspective of a Sensor Company Ewald Wachmann, Senior Manager – ams AG, Austria (read more..)

  • Innovative Process Chains for Sensors Horst Theuss, Lead Principal – Infineon Technologies Regensburg, Germany (read more..)

Session 2:

  • TrustworSys – Towards Trustworthiness for IoT Sensors Thomas Pieber, TU Graz, Infineon Technologies Austria AG, Austria (read more..)

  • Advanced Packaging of a Micro-Gravity Sensor System: Microsystem Integration from a Hardware Perspective Luke Middelburg, TU Delft, Netherlands (read more..)

  • From Parking Assistance to Automated Parking using a Time-Of-Flight Camera Jesus Murgoitio, Project Manager – Tecnalia, Spain (read more..)
  • Passive RFID Sensors – Battery-Free, Wireless Pressure Measurements Dr. Andreas Weder, Team Manager of Module Integration Group – Fraunhofer Institute for Photonic Microsystems (IPMS), Germany (read more..)

Session 3:

  • Virtual Prototyping for Shortest Time-to-Market of New IoT Products (Focus: Design for Reliability) Prof. Sven Rzepka, Fraunhofer Institute for Electronic Nano Systems (ENAS), Germany (read more..)

  • Detecting Particles – Make it Simple by a new Fine Dust Sensor, Jörg Schulz, Head of R&D – Dr. Födisch Umweltmesstechnik AG, Germany (read more..)

Short Facts

Date: April 11, 2018

Co-located: Smart Systems Integration 2018

Intended audience: IoSense project members and interested third parties with relevant backgrounds

Estimated number of participants: 40-50

Address: Hilton Dresden; An der Frauenkirche 5, 01067 Dresden


Registration Fee (until 28.02.2018): 180,00 €

Registration Fee: 300,00 €

Additional Material:

Flyer for printing

Document 4 pages

Call for Participation