Dissemination

IoSense_Brochure

IoSense Publications

Alarcon, L. G., Recalde, M. E., Marcano, M., & Marti, E. (2018). Adaptable emergency braking based on a fuzzy controller and a predictive model. IEEE International Conference on Vehicular Electronics and Safety (ICVES) 2018. doi:10.1109/ICVES.2018.8519586

Albrecht, J., Gadhiya, G., Rzepka, S. (NOT YET PUBLISHED). Reliability of IoT sensor systems: New methods for the efficient and comprehensive reli-ability assessment  – Sensor System Solutions. Springer.

Albrecht, J., Weissbach, M., Vobl, M., Krumbein, U., & Rzepka, S. (2018). Mechanical Characterization of MEMS-Microphones by Means of Nanoindentation and Coupled Finite Element Analysis. Electronics Packaging Technology Conference (EPTC). Singapore: NOT YET PUBLISHED

Albrecht, J., Weissbach, M., Vobl, M., Krumbein, U., & Rzepka, S. (NOT YET PUBLISHED). Nanoindentation and Coupled Finite Element Analysis for Robustness and Design Evaluation of MEMS-Microphones. ASDAM 2018. Smolenice

Althunibat, S., Antonopoulos, A., Kartsakli, E., Granelli, F., & Verikoukis, C. (2016). Countering Intelligent Dependent Malicious Nodes in Target Detection Wireless Sensor Networks. IEEE Sensors 2016. doi:http://dx.doi.org/10.1109/JSEN.2016.2606759

Antonopoulos, A., & Verikoukis, C. (2016). Misbehavior Detection in the Internet of Things: A Network-Coding-aware Statistical Approach. IEEE INDIN 2016. Futuoscope-Poitiers France. doi:10.1109/INDIN.2016.7819313

Antonopoulos, A., & Verikoukis, C. (2017). COPS: Cooperative Statistical Misbehavior Mitigation in Network-Coding-aided Wireless Networks. IEEE Transactions on Industrial Informatics. doi:10.1109/TII.2017.2754579

Artuñedo, A., del Toro, R. M., & Haber, R. E. (2017). Consensus-Based Cooperative Control Based on Pollution Sensing and Traffic Information for Urban Traffic Networks. Sensors. doi:10.3390/s17050953

Assmann, U., Grzelak, D., Mey, J., Pukhkaiev, D. (2019). Cross-Layer Adaptation in Multi-layer Autonomic Systems (Invited Talk). 45th International Conference on Current Trends in Theory and Practice of Computer Science, Nový Smokovec. DOI: 10.1007/978-3-030-10801-4_1

Baumgart, M., Consani, C., Dielacher, M., & Druml, N. (2017). Optical simulation of Time-of-Flight sensor accuracy in rain. CLEO/Europe-EQEC conference. Munich. doi:http://dx.doi.org/10.1109/CLEOE-EQEC.2017.8086908

Baumgart, M., Dielacher, M., Druml, N., & Consani, C. (2017). Simulating Rain Droplets Influence on Distance Measurement with a Time-of-Flight Camera Sensor. Eurosensors. Paris. doi:10.3390/proceedings1040287

Baumgart, M., Druml, N., & Consani, C. (2018). Procedure Enabling Simulation and In-Depth Analysis of Optical Effects in Camera-based Time-of-Flight Sensors. ISPRS TC II Symposium. Riva del Garda. doi:https://doi.org/10.5194/isprs-archives-XLII-2-83-2018

Baumgart, M., Druml, N., Consani, C. (NOT YET PUBLISHED). Multipath raytracing-based modelling of Time-of-Flight cameras: method and applications to semi-transparent and scattering media – Sensor System Solutions. Springer.

Baumgart, M., Druml, N., Dielacher, M., & Consani, C. (2018). Investigating Intense Rainfall Influence on Distance Measurement with a Time-of-Flight Camera Sensor using Optical Ray-Tracing Simulation Technique. Eurosensors 2018. doi:http://dx.doi.org/10.3390/proceedings2131056

Baumgart, M., Druml, N., Dielacher, M., & Consani, C. (2018). Modelling and Optical Time-of-Flight cameras in OpticStudio and Python: method and aplications. ASDAM 2018, (pp. 219-220). Smolenice. doi:http://dx.doi.org/10.1109/ASDAM.2018.8544507

Beruvides, G., Castaño, F., Haber, R. E., Quiza, R., & Villalonga, A. (2017). Coping with Complexity When Predicting Surface Roughness in Milling Processes: Hybrid Incremental Model with Optimal Parametrization. Complexity, 1-11. doi:10.1155/2017/7317254

Boiger, R., Defregger, S., Grbic, M., Köck, A., Mücke, M., Wimmer-Teubenbacher, R., & Zaragoza Travieso, B. (NOT YET PUBLISHED). Exploring wavelet coefficients as robust features in TCO MOx gas sensor signal processing. Eurosensors 2018 Conference on Digital System Design (DSD). Graz

Boiger, R., Defregger, S., Grbic, M., Köck, A., Mücke, M., Wimmer-Teubenbacher, R., Zaragoza Travieso, B., (2018). Exploring temperature-modulated operation mode of metal oxide gas sensors for robust signal processing. EUROSENSORS 2018, 9th – 12th September 2018, Graz, Austria, Proceedings 2018, 2, 1058; doi:10.3390/proceedings2131058

Boiger, R., Defregger, S., Köck, A., Mücke, M., Wimmer-Teubenbacher, R., & Toschkoff, G. (2018). Temperature modulated operation of SnO2 – based gas sensor arrays. ASDAM 2018, (pp. 211-214). Smolenice. doi:http://dx.doi.org/10.1109/ASDAM.2018.8544491

Bosetti, G., Manz, J., Schrag, G.,Dehé, A. (2017). Modeling of an out-of-plane capacitive MEMS transducer with dynamically coupled electrodes. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). Bordeaux. 10.1109/DTIP.2017.7984459

Castaño, F., Beruvides, G., Haber, R. E., & Artuñedo, A. (2017). Obstacle Recognition Based on Machine Learning for On-Chip LiDAR Sensors in a Cyber-Physical System. Sensors. doi:10.3390/s17092109

Castaño, F., Beruvides, G., Haber, R. E., & Villalonga, A. (2017). Time-To-Failure Modelling in On-Chip LiDAR Sensors for Automotive Applications. 5th International Symposium on Sensor Science (i3s). Barcelona. doi:10.3390/proceedings1080809

Castaño, F., Beruvides, G., Haber, R. E., & Villalonga, A. (2018). Self-Tuning Method for Increasing Reliability in Obstacle Detection based on Internet-of-Things LiDAR Sensor Models. Sensors 2018, (p. 18(5)). doi:doi:10.3390/s18051508

Castaño, F., Beruvides, G., Villalonga, A., Haber, R. E. (NOT YET PUBLISHED). Computational intelligence for simulating a LiDAR sensor – Sensor System Solutions. Springer.

Consani, C., Druml, N., Dielacher, M., & Baumgart, M. (2018). Fog effects on Time-of-Flight imaging investigated by ray-tracing simulations. Proceedings (MDPI Journal). doi:http://dx.doi.org/10.3390/proceedings2130859

Coppeta, R.,Lahlalia, A., Kozic, D., Hammer, R., Riedler, J., Toschkoff, G., Singulani, A., Ali, Z., Sagmeister, M., Carniello, S., Selberherr, S., Filipovic, L. (NOT YET PUBLISHED). Electro-Thermal-Mechanical modelling of gas sensor hotplates – Sensor System Solutions. Springer.

Della Mea, A., Padilha Leitzke, J., & Zangl, H. (2018). Considerations on Solar Energy Harvesting for Smart Systems. Proceedings Smart System Integration 2018. Auersbach: Wissenschaftliche Scripten. Opgehaald van https://www.aau.at/intelligente-systemtechnologien/sensors-and-actuators/publikationen/

Druml , N., Pietsch, T., Dielacher, M., Stegery, C., Baumgart, M., Consani, C., Herndl, T., Holweg, G. (2018). Virtual White Cane featuring Time-of-Flight 3D. 21st Euromicro Conference on Digital System Design (DSD). Prag. DOI: 10.1109/DSD.2018.00081

Druml, N., Pietsch, T., Baumgart, M., Consani, C., Herndl, T., Holweg, G. (NOT YET PUBLISHED). A Smart Phone based Virtual White Cane Prototype featuring Time-of-Flight 3D Imaging  – Sensor System Solutions. Springer.

Druml,N. , Rutte-Vas, B., Wilfing,S., Consani,C., Baumgart, M., Herndl, T., Holweg, G. (2017). Safety-Critical Human Detection featuring Time-of-Flight Environment Perception. 22nd IEEE International Conference on Emerging Technologies and Factory Automation (ETFA). DOI: 10.1109/ETFA.2017.8247647

Duy, T. P. (2018). Towards wireless industrial control over 6TiSCH networks. Seventh International Conference on Telecommunications and Remote Sensing (ICTRS). Barcelona. DOI: 10.1145/3278161.3278164

Faller, L.-M., & Zangl, H. (2017). Considerations on pre-stress in a 3D-printed capacitive force/pressure sensor. 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Dresden: IEEE. doi:10.1109/EuroSimE.2017.7926279

Faller. L.-M., Granig W., Krivec M., Abram A., & Zangl (2018). Rapid prototyping of force/pressure sensors using 3D- and inkjet-printing. IOP Journal of Micromechanics and Microengineering. DOI: 10.1088/1361-6439/aaadf4

Faller. L.-M., Granig, W., Krivec, M., Abram, A., & Zangl, H. (2018). Rapid Prototyping Technologies for the Fabrication of Force/Pressure Sensors. IOP Journal of Michromechanics and Microengineering. doi:http://dx.doi.org/10.1088/1361-6439/aaadf4

Fladischer, K., Leitgeb, V., Mitterhuber, L., Maier, G., Keckes, J., Sagmeister, M., Toschkoff & G., Defregger, S. Thermo-physical properties of thin layers investigated with Time Domain Thermoreflectance and Scanning Thermal Microscopy on the example of a 500 nm thin, CVD grown tungsten film

Godoy, J., Haber, R., Muñoz, J., & Matia, F. G. (2018). Smart Sensing of Pavement Temperature Based on Low-Cost Sensors and V2I Communications. Sensors 2018, (p. 18(5)). doi:doi:10.3390/s18072092

Granig W., Slimane A., & Zangl H. (2018). Statistical Modeling of Integrated Sensors for Automotive Applications. International Conference of Electrical and Electronic Technologies for Automotive. Milan. Doi: 10.23919/EETA.2018.8493172

Granig, W., Faller, L.-M., & Zangl, H. (n.d.). Sensor System Optimization to meet Reliability Targets. Microelectronics Reliability. doi:http://dx.doi.org/10.1016/j.microrel.2018.06.005

Granig, W., Faller, L.-M., Zangl, H. (NOT YET PUBLISHED). Sensor System Optimization under Uncertainty  – Sensor System Solutions. Springer.

Granig, W., Hammerschmidt, D., & Zangl, H. (2017). Calculation of Failure Detection Probability on Safety Mechanisms of Correlated Sensor Signals According to ISO 26262. SAE International Journal of Passenger Cars – Electronic and Electrical Systems, 144-155. Retrieved from https://doi.org/10.4271/2017-01-0015

Granig, W., Hammerschmidt, D., & Zangl, H.,  (NOT YET PUBLISHED). Dependability Considerations of Redundant Sensor Systems. Reliability Engineering and System Safety.

Granig, W., Hammerschmidt, D., Zangl, H. (2017). Diagnostic Coverage Estimation Method for Optimization of Redundant Sensor Systems. Proceedings of the IEEE Sensors Conference 2017. Glasgow. Doi: 10.1109/ICSENS.2017.8234088

Granig, W., Rasbornig, F., Hammerschmidt, D., Motz, M., Zettler, T., Strasser, M., Michelutti, A. (2017). Redundant and Diverse Magnetic Field Digital Linear Hall Sensor Concept for ASIL D Applications. SAE Technical Paper. Doi: https://doi.org/10.4271/2017-01-0053.

Grzelak, D., Mai, C., Schöne, R., Falkenberg, J.,Aßmann, U. (NOT YET PUBLISHED). A Software Toolkit for Complex Sensor Systems in Fog Environments – Sensor System Solutions. Springer.

Grzelak, D., Mey, J., & Aßmann, U. (2018). Design and Concept of an Osmotic Analytics Platform based on R Container. 14th International Conference on Foundations of Computer Science (FCS 2018). Las Vegas. doi:ISBN: 1-60132-476-6

Grzelak,D.,  Mai, C., Aßmann, U. (NOT YET PUBLISHED). Towards a Software Architecture for Near Real-Time Applications of IoT. 4th International Conference on Internet of Things, Big Data and Security (IoTBDS).

Haber, R. E., Beruvides, G., Quiza, R., & Hernandez, A. (2017, October 17). A Simple Multi-Objective Optimization Based on the Cross-Entropy Method. IEEE Access, 22272 – 22281. doi:10.1109/ACCESS.2017.2764047

Jacobs, B., van Driel, W., & Schuld, M. (2018). Lumen maintenance prediction for LEDs – new insights. EuroSimE. Toulouse. doi:http://dx.doi.org/10.1109/EuroSimE.2018.8369895

Jaksic, S., Bartocci, E., Grosu, R., Nickovic, D. (2018). An Algebraic Framework for Runtime Verification. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. DOI: 10.1109/TCAD.2018.2858460

Kjellman,J.,  Hosseini,N., Hwan Song, J., Tongnyuy, T., Dwivedi,S., Troia,  B., Figeys,  B., Kerman,S.,  Stassen,A. , Neutens,P., Severi, S., Jansen,R.,  Soussan, P., Saseendran,  S.S., Marinins, A.,  Rottenberg, X. (NOT YET PUBLISHED). Integrated Photonic Microsystems  – Sensor System Solutions. Springer.

Kloibhofer, R., Kristen, E., & Jakšić, S. (2018). Safety and Security in a Smart Production Environment. 37th International Conference On Computer Safety, Reliability & Security (Safecomp 2018). Västerås. doi:http://dx.doi.org/10.1007/978-3-319-99229-7_17

Köck, A., Deluca, M., Sosada-Ludwikowska, F., Wimmer-Teubenbacher, R., Lackner, E., Rohracher, K., . . . Singh, V. (2018). Multifunctional Nanoparticles – Key for Optimizing Chemical Nanosensors. ASDAM 2018, (pp. 227-231). Smolenice. doi:http://dx.doi.org/10.1109/ASDAM.2018.8544608

Krivec, M., Roshanghias, A., & Binder, A. (2017). 3DInkPack – Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping. Proceedings of Eurosensors 2017, 1, p. 609. doi:http://dx.doi.org/10.3390/proceedings1040609

Lattarulo, R., Perez, J., & Dendaluce, M. (2017). A Complete Framework for Developing and Testing Automated Driving Controllers. IFAC 2017 World Congress. Toulouse. doi:http://dx.doi.org/10.1016/j.ifacol.2017.08.043

Leitzke, J. P., Mea, A. D., Faller, L.-M., Mühlbacher-Karrer, S., & Zangl, H. (2018, July). Wireless differential pressure measurement for aircraft. Elsevier Measurement, 459-465. doi:10.1016/j.measurement.2017.12.042

Mai, C., Grzelak, D., Zia, M., D.Lemme, & Aßmann, U. (2019). An Architecture for a Distributed Lean Innovation Management System. ICCRD 2019. Da Lat. NOT YET PUBLISHED: International Journal of Innovation, Management and Technology

Mai, C., Schöne, R., Mey, J., Kühn, T., & Aßmann, U. (2018). Adaptive Petri Nets – A Petri Net Extension for Reconfigurable Structures. ADAPTIVE 2018: The Tenth International Conference on Adaptive and Self-Adaptive Systems and Applications. IARIA. doi:ISBN: 978-1-61208-610-1

Mansouri,B. El, van Driel, W.D., Zhang, G.Q.  (NOT YET PUBLISHED). Ultraviolet Sensing in WBG – SiC  – Sensor System Solutions. Springer.

Manz, J., Bosetti, G., Dehé, A., & Schrag, G. (2017). A novel silicon “star-comb” microphone concept for enhanced signal-to-noise-ratio: Modeling, design and first prototype. 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS). Kaohsiung. doi:10.1109/TRANSDUCERS.2017.7993989

Manz, J., Dehe, A., Schrag, G. (2017). Modeling high signal-to-noise ratio in a novel silicon MEMS microphone with comb readout. SPIE Microtechnologies. DOI: 10.1117/12.2266014

Mekikis, P.-V., Kartsakli, E., Antonopoulos, A., Alonso, L., & Verikoukis, C. (2018, January 23). Connectivity Analysis in Clustered Wireless Sensor Networks Powered by Solar Energy. IEEE Transactions on Wireless Communications, 2389-2401. doi:10.1109/TWC.2018.2794963

Middelburg, L., Elmansouri, B., Poelma, R., van Zeijl, H. W. (2018). Designing a 100 [aF/nm] capacitive transducer. 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). DOI: 10.1109/EuroSimE.2018.8369954

Middelburg, L., Elmansouri, B., Poelma, R., Zhang, G. Q. (2018) Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications. IEEE SENSORS. DOI: 10.1109/ICSENS.2018.8589630

Middelburg, L.M.,van Driel,  W.D., Zhang, G.Q. (NOT YET PUBLISHED). From Si towards SiC technology for Harsh Environment Sensing – Sensor System Solutions. Springer.

Mikolasek, M., Meri, J., Chymo, F., Ondrejka, P., Rehacek, V., Predanocy, M., . . . Hotovy, I. (NOT YET PUBLISHED). Novel Cu2O gas sensor prepared by potentiostatic electrodeposition on IDE electrodes. IOP Science Journal of Physics: Conference Series (JPCS)

Mikolášek, M., Ondrejka, P., Chymo, F., Řeháček, V., Predanocy, M., Kostič, I., & Hotový, I. (2018). Cu2O Based Gas Sensor Prepared by Electrodeposition. ASDAM 2018. ISBN 978-1-5386-7488-8, pp. 221-224. Smolenice: IEEE

Mitterer, T., & Zangl, H. (NOT YET PUBLISHED). Automatic Integration of Transducers in ROS via Transducer Electronic Data Sheets. IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2018). Madrid

Mitterer, T., & Zangl, H. (NOT YET PUBLISHED). Transducer Electronic Data Sheets on Smart Ultra Low Power Devices. Smart Systems Integration. Dresden

Murgoitio Larrauri, J., Martí Muñoz, E.D., Vaca Recalde, M.E., Hillbrand, B., Tengg, A., Pilz,Ch., Druml, N. (NOT YET PUBLISHED). Sensor testing for Smart Mobility scenarios: From Parking Assistance to Automated Parking  – Sensor System Solutions. Springer.

Pham, N. P., Du Bois, B., Van Hoof, R., Winderickx, G., Tyagi, H. K., Sabuncuoglu, D., & Tilmans, H. A. (NOT YET PUBLISHED). Post processing of a SiN-based photonic stack above a CMOS imager sensor. Electronics Packaging Technology Conference (EPTC 2018). Singapore: NOT YET PUBLISHED

Pieber, T. W.,  Ulz, T., & Steger, C. (2017). SystemC Test Case Generation with the Gazebo Simulator. Proceedings of the 7th International Conference on Simulation and Modeling Methodologies, Technologies and Applications (SIMULTECH) 2017 (pp. 65-72). Madrid: SciTePress. doi:10.5220/0006404800650072

Pieber, T. W., Ulz, T., Steger, C. (2018). Using Gazebo to Generate Use Case Based Stimuli for SystemC. 7th International Conference SIMULTECH. Madrid. DOI: 10.1007/978-3-030-01470-4_13

Pieber, T. W., Ulz, T., Steger, C. (2018). Using Gazebo to Generate Use Case Based Stimuli for SystemC. Advances in Intelligent Systems and Computing.

Pieber, T. W., Ulz, T., Steger, C. (NOT YET PUBLISHED). Model-based Design of Secured Power Aware Smart Sensors  – Sensor System Solutions. Springer.

Pieber, T. W., Ulz, T., Steger, C., & Matischek, R. (2017). Hardware Secured, Password-based Authentication for Smart Sensors for the Industrial Internet of Things. 11th International Conference on Network and System Security (NSS) 2017 (pp. 632-642). Helsinki: Springer. Opgehaald van https://doi.org/10.1007/978-3-319-64701-2_50

Predanocy, M., Hotový, I., Mikolášek, M., Botcher, R., & Spiess, L. (NOT YET PUBLISHED). NiO gas sensing element prepared on needle-shaped silicon substrate. IOP Science Journal of Physics: Conference Series (JPCS), [NOT YET PUBLISHED]

Pubill, D., Serra, J., & Verikoukis, C. (2018). Harvesting artificial light indoors to power perpetually a Wireless Sensor Network node. IEEE CAMAD 2018. Barcelona. doi:http://dx.doi.org/10.1109/CAMAD.2018.8514995

Ramantas, K., Kartsakli, E., Irazabal, M., Antonopoulos, A., & Verrikoukis, C. (2017). Implementation of an SDN-enabled 5G Experimental Platform for Core and Radio Access Network Support. IEEE IMCL2017. Thessaloniki Greece. doi:http://dx.doi.org/10.1007/978-3-319-75175-7_77

Roshanghias, A., Krivec, M., & Baumgart, M. (2017, October 26). Sintering strategies for inkjet printed metallic traces in 3D printed electronics. Flexible and Printed Electronics, 2(4). Retrieved from https://doi.org/10.1088/2058-8585/aa8ed8

Schoitsch, Erwin (2017). Smart Systems Everywhere–how much smartness is tolerable? IDIMT 2017, p. 361-374. DOI: 10.5281/zenodo.1043960

Schoitsch, Erwin (2018). Smart Systems Everywhere – Intelligence, Autonomy, Technology and Society. IDIMT 2018, p. 153-165. DOI: 10.5281/zenodo.2590949

Serra, J., Pubill, D., & Verikoukis, C. (2017). Distributed Massive MIMO for Estimation of a Correlated Source Vector in Sensor Networks. Proceedings of IEEE International Symposium on Signal Processing and Information Technology. Bilbao. doi: 10.5281/zenodo.1161201

Serra; J., Pubill, D.,  Verikoukis, C. (NOT YET PUBLISHED). Power consumption minimization of Wireless Sensor Networks in the Internet of Things era  – Sensor System Solutions. Springer.

Steinbaeck, J., Druml, N., Tengg, A., & Steger, C. H. (2018). Time-of-Flight Cameras for Parking Assistance: A Feasibility Study. ASDAM 2018, (pp. 215-218). Smolenice. doi:http://dx.doi.org/10.1109/ASDAM.2018.8544683

TECNALIA + VIF (NOT YET PUBLISHED). Car parking assistance based on Time-of-Flight camera. 10th IAV 2019 Intelligent Autonomous Vehicles

Theuss, H. et al. (NOT YET PUBLISHED). A MEMS Microphone in a Fan-Out Wafer Level Package. ECTC (Electronics Components Technology Conference). Las Vegas.

Theuss, H., Kolb, S., Eberl, M., Schaller, R. (NOT YET PUBLISHED). Miniaturized Photo-Acoustic Gas Sensor for CO2  – Sensor System Solutions. Springer.

Ulz, T., Pieber, T. W., & Steger, C. (2018). QSNFC: Quick and Secured Near Field Communication for the Internet of Things. IEEE International Conference on RFID (RFID). DOI: 10.1109/RFID.2018.8376190

Ulz, T., Pieber, T. W., & Steger, C. (2018). Secured Remote Configuration Approach for Industrial Cyber-Physical Systems. IEEE Industrial Cyber-Physical Systems (ICPS). DOI: 10.1109/ICPHYS.2018.8390811.

Ulz, T., Pieber, T. W., Steger, C., Haas, S., Matischek, R., & Bock, H. (2017). Hardware-Secured Configuration and Two-Layer Attestation Architecture for Smart Sensors. Euromicro Conference on Digital System Design (DSD) 2017 (pp. 229-236). Vienna: IEEE. doi:10.1109/DSD.2017.24

Ulz, T., Pieber, T., Höller, A., Haas, S., & Steger, C. (2017). Secured and Easy-to-Use NFC-Based Device Configuration for the Internet of Things. IEEE Journal of Radio Frequency Identification, 1(1), 75-84. doi: 10.1109/JRFID.2017.2745510

Ulz, T., Pieber, T., Steger, C., Haas, S., & Matischek, R. (NOT YET PUBLISHED). Secured Multi-Purpose Near Field Communication Interface for Robots using Components off the Shelf. IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2018). Madrid

Ulz, T., Pieber, T., Steger, C., Haas, S., Bock, H., & Matischek, R. (2017). Bring your own key for the industrial Internet of Things. IEEE International Conference on Industrial Technology (ICIT) (pp. 1430-1435). Toronto: IEEE. doi:10.1109/ICIT.2017.7915575

Ulz, T., Pieber, T., Steger, C., Haas, S., Matischek, R., & Bock, H. (2017). Sneakernet on wheels: Trustworthy NFC-based robot to machine communication. IEEE International Conference on RFID Technology & Application (RFID-TA). Warsaw: IEEE. doi:10.1109/RFID-TA.2017.8098906

Ulz, T., Pieber, T., Steger, C., Höller, A.,  Haas, S., Matischek, R. (2017). Automated Credential Derivation for the Secured Configuration of Devices in the Internet of Things. Warsaw. DOI: 10.1109/SIES.2018.8442106

Ulz, T., Pieber, T., Steger, C., Lesjak, C., Bock, H., & Matischek, R. (2017). SECURECONFIG: NFC and QR-code based hybrid approach for smart sensor configuration. IEEE International Conference on RFID. Phoenix: IEEE. doi:10.1109/RFID.2017.7945585

Ulz, T., Pieber,T., Steger. C., Matischek, R., Bock, H. (2017) Towards Trustworthy Data in Networked Control Systems: A Hardware-Based Approach. Proceedings of the 2017 IEEE International Conference on Emerging Technologies and Factory Automation (ETFA). DOI: 10.1109/ETFA.2017.8247636

Ulz,T., Pieber, T., Steger, C., Höller, A. (2018). Automated Authentication Credential Derivation for the Secured Configuration of IoT Devices. IEEE 13th International Symposium on Industrial Embedded Systems (SIES). DOI: 10.1109/SIES.2018.8442106

van Driel, W., Beijer, J., Bikker, J., van Blokland, C., Ankomah, C., & Jacobs, B. (2018). Color maintenance prediction for LED-based products. EuroSimE. Toulouse. doi:http://dx.doi.org/10.1109/EuroSimE.2018.8369875

van Driel, W., Jacobs, B., Schenkelaars, D., Klompenhouwer, M., Poelma, R., El Mansouri, B., & Middelburg, L. (2017). Prognostics & Health Management for LED-based Applications. EuroSimE. Dresden: IEEE. doi:10.1109/EuroSimE.2017.7926293

van Driel,W.D., Middelburg, L.M., El Mansouri,B., Jacobs, B.J.C. (NOT YET PUBLISHED). Health monitoring for Lighting Applications  – Sensor System Solutions. Springer.

Vardakas, J., Kartsakli, E., Antonopoulos, A., Papaioannou, S., Kalfas, G., Pleros, N., & Verikoukis, C. (2017). Quality of Service Provisioning in High-Capacity 5G Fronthaul/Backhaul Networks. IEEE IMCL2017. Thessaloniki Greece. doi:http://dx.doi.org/10.1007/978-3-319-75175-7_78

Villalonga, A., Beruvides, G., Castaño, F., & Haber, R. (2018). Industrial Cyber-Physical System for Condition-based Monitoring in Manufacturing Processes. 1st IEEE International Conference on Industrial Cyber-Physical Systems (ICPS-2018). Saint Petersburg. doi:http://dx.doi.org/10.1109/ICPHYS.2018.8390780

Villalonga, A., Beruvides, G., Castaño, F., & Haber, R. E. (2018). Condition-based Monitoring Architecture for CNC Machine Tools based on Global Knowledge. 16th IFAC Symposium on Information Control Problems in Manufacturing (INCOM2018). Bergamo. doi:http://dx.doi.org/10.1016/j.ifacol.2018.08.259

Wenig, F., Klanatsky, P., Heschl, C., Mateis, C., & Dejan, N. (2017). Exponential pattern recognition for deriving air change rates from CO2 data. IEEE 26th International Symposium on Industrial Electronics (ISIE) (pp. 1507-1512). Edinburgh: IEEE. doi:10.1109/ISIE.2017.8001469

Wimmer-Teubenbacher, R., Defregger, S., Boiger, R., Köck, A., Hotovy, I., Mikolasek, M., & Predanocy, M. (2018). Advanced Technology Processes for Manufacturing of SnO2 and NiO-Based Gas Sensors and Their Properties. ASDAM 2018. Smolenice. doi:DOI: 10.1109/ASDAM.2018.8544639

Wimmer-Teubenbacher, R., Sosada-Ludwikowska, F. Defregger, S., & Köck, A. (NOT YET PUBLISHED.). CMOS integrable Metal-oxide based CO2 gas sensing. Eurosensors 2018 Conference on Digital System Design (DSD).

Wimmer-Teubenbacher, R., Sosada-Ludwikowska, F., Travieso, Z. B., Defregger, S., Tokmak, O., Niehaus, J. S., & Köck, A. (2018). CuO Thin Films Functionalized with Gold Nanoparticles for Conductometric Carbon Dioxide Gas Sensing. MDPI. DOI: 10.3390/chemosensors6040056

Wimmer-Teubenbacher, R., Sosada-Ludwikowska, F.; Zaragoza Travieso, B.; Defregger, S., Tokmak, O., Niehaus, J. S., Deluca, M., Köck, A., CuO Thin Films Functionalized with Gold Nanoparticles for Conductometric Carbon Dioxide Gas Sensing, Chemosensors 2018, 6, 56; doi:10.3390/chemosensors6040056

Zangl, H., Faller, L.-M., & Granig, W. (2017). Optimal design of angular position sensors. COMPEL. doi:http://dx.doi.org/10.1108/COMPEL-02-2017-0099

Zendel, O., Honauer, K., Murschitz, M., Humenberger, M., Dominguez, G. F. (2017) Analyzing Computer Vision Data – The Good, the Bad and the Ugly. The IEEE Conference on Computer Vision and Pattern Recognition (CVPR), 2017, pp. 1980-1990

Zendel, O., Honauer, K., Murschitz, M., Humenberger, M., & Domínguez, G. F. (2017). Analyzing Computer Vision Data — The Good, the Bad and the Ugly. IEEE Conference on Computer Vision and Pattern Recognition (CVPR) (pp. 1980-1990). Honolulu: IEEE. doi:10.1109/CVPR.2017.706

Large Enterprise (LE)

austria micro systems AG (AMS)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Book Electro-Thermal-Mechanical modelling of gas sensor hotplates Raffaele Coppeta, Ayoub Lahlalia, Darjan Kozic, René Hammer, Johann Riedler, Gregor Toschkof, Anderson Singulani, Zeeshan Ali, Martin Sagmeister, Sara Carniello, Siegfried Selberher, Lado Filipovic IoSense Book, p. 20-82   2019    

Events and Exhibitions

Description Event Date Location Target Group Photos
“IoT from the Perspective of a Sensor Company” Ewald Wachmann, Senior Manager IoSense Spring School 2018 2018-04-12 Dresden, Germany PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies

ams Netherlands B.V. (AMS-NL)

Events and Exhibitions

Description Event Date Location Target Group Photos
“Development of an Integrated Relative Humidity Sensor in the Framework of the IoSense Project” Frederik Vanhelmont IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies
“Water Tightness Tests of Pressure Sensors” by Yushan Zhang and Olaf Wunnicke Lunch colloquium at Stan Ackermans Institute 20.04.2018 Technical University, Eindhoven Students and scientists at TU/e  
Demonstration of Real time monitoring of environmental sensors (RH & P), and tilt demonstrator based on P-sensing. Guido Stefanuto and Stephanie Segura Precisie-beurs 15.11.2017 & 16.11.2017 Koningshof, Veldhoven, Netherlands Engineers in precision engineering (sensing, motion & control, manufacturing, micro-assembly…)  

Infineon Technologies AG (IFAG)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Paper   A NOVEL SILICON “STAR-COMB” MICROPHONE CONCEPT FOR ENHANCED SIGNAL-TO-NOISE-RATIO: DESIGN, MODELING AND FIRST PROTOTYPE Johannes Manz, Gabriele Bosetti, Alfons Dehé, and Gabriele Schrag Transducers 2017        
Book Miniaturized Photo-Acoustic Gas Sensor for CO2 Horst Theus, Stefan Kolb, Matthias Eberl, Rainer Schaller IoSense Book, p 83-103   2019    
Paper A MEMS Microphone in a Fan Out Wafer Level Package Horst Theuss et al. ECTC (Electronics Components Technology Conference)   Las Vegas, May 29-31, 2019    

Events and Exhibitions

Description Event Date Location Target Group Photos
Posters & Short Presentations on IoSense Topics IFAG-Innovation Weeks Events June 22, 2017; July 31, 2017; Oct 24, 2017; Jan 14, 2018; May 3, 2018 IFAG Regensburg & Munich All Infineon Management & Engineers (incl. IFD, IFAT, & further sites)  
The International Conference on Advanced Semiconductor Devices and Microsystems ASDAM 2018 devoted to the latest results of research and development in the field of new semiconductor devices and microsystems. ASDAM 2018 The 12th International Conference on Advanced Semiconductor Devices and Microsystems 21.10 – 24.10.2018 Bratislava, Slovakia Leading experts from institutes and universities  
 Presentation  Infineon Internal – INNO Spring 2017  May 16th 2017      
The European meeting where the latest progress in microtechnology and nanotechnology systems and applications are presented with a focus on the areas of smart sensors, cyber-physical systems, bioMEMs, medical devices, and integrated photonics. SPIE Microtechnologies 08.05.-10.05.2017 Barcelona, Spain    
The 2017 IEEE International Conference on RFID is the premier conference for exchanging all technical research in RFID. The conference attendance boasts an outstanding mix of practitioners and researchers from industry and academia. IEEE International Conference on RFID 09.05.-11.05.2017 Phoenix, USA industry and academia  
This unique single-meeting event brings together participants interested in MEMS/MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS/MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks IEEE Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) 29.05.-01.06.2017 Bordeaux, France    
The world’s premiere conference in MEMS sensors, actuators and integrated micro- and nano-systems showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro- and nanotechnology. Transducers (International Conference on Solid-State Sensors, Actuators and Microsystems) 18.06.-22.06.2017 Kaohsiung, Taiwan    
“Innovative Process Chains for Sensors” Horst Theuss, Lead Principal IoSense Spring School 2018 12.04.201
8
Dresden, Germany PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location  Addressed Topic Photos
Plenary Presentation SPIE Microtechnologies May 8-10, 2017 Barcelona “MEMS Microphone Innovations Towards High Signal to Noise Ratios”  
Presentation & Proceedings SPIE Microtechnologies May 8-10, 2017 Barcelona “Modelling high signal to noise ratio in a novel silicon MEMS microphone with comb readout,”
Presentation & Proceedings IEEE DTIP (Design, Test, Integration & Packaging of MEMS/MOEMS) May30-June1, 2017 Bordeaux Modeling of an Out-of-plane Capacitive MEMS Transducer with Dynamically Coupled Electrodes  
Presentation & Proceedings Transducers (International Conference on Solid-State Sensors, Actuators and Microsystems)June 18-22, 2017 June 18-22, 2017 Kaohsiung, Taiwan A NOVEL SILICON ”STAR-COMB” MICROPHONE CONCEPT FOR ENHANCED SIGNAL-TO-NOISE-RATIO: MODELING DESIGN, AND FIRST PROTOTYPE  
Presentation & Handout Seminar at Aalto University, School of Electrical Engineering, Finland within the seminar framework ELEC-E8713 Materials & Microsystems Integration June 19, 2017 Helsinki Packaging of MEMS – Integrating MEMS and ICs  
Professional Development Course (PDC), incl. Handout IEMT (International Electronics Manufacturing Technology Conference) 2018 Sept 4-6, 2018 Melaka, Malaysia Packaging for MEMS and Sensors link

Infineon Technologies Austria AG (IFAT)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Publication in Conference proceedings/Workshop Safety-Critical Human Detection featuring Time-of-Flight Environment Perception Norbert Druml Special Section: Recent trends and developments in Industry 4.0 motivated robotic solutions        
Publication in Conference proceedings/Workshop Redundant and Diverse Magnetic Field Digital Linear Hall Sensor for ASIL D Applications. Granig W., Rasbornig F., Hammerschmidt D., Motz M., Zettler T., Strasser M. & Michelutti A. SAE International Journal of Passenger Cars – Electronic and Electrical Systems   2017 https://doi.org/10.4271/2017-01-0053  
Scientific Publication Calculation of Failure Detection Probability on Safety Mechanisms of Correlated Sensor Signals According to ISO 26262. Granig, W., Hammerschmidt, D., & Zangl, H. SAE International Journal of Passenger Cars – Electronic and Electrical Systems, 144-155   2017  https://doi.org/10.4271/2017-01-0015

Open Access

Publication in Conference proceedings/Workshop Optimal Design of Angular Position Sensors Hubert Zangel, Lisa-Marie Faller and Wolfgang Granig  COMPEL – The internaltion journal for computation and mathematics in electrical and electronic engeineering    2017  https://doi.org/10.1108/COMPEL-02-2017-0099  
Publication in Conference proceedings/Workshop Diagnostic Coverage Estimation Method for Optimization of Redundant Sensor Systems Wolfgang Granig, Dirk Hammerschmidt, Hubert Zangl  Proceedings of the IEEE Sensors Conference 2017    2017  https://doi.org/10.1109/ICSENS.2017.8234088  
Publication in Conference proceedings/Workshop Rapid Prototyping Technologies for the Fabrication of Force/Pressure Sensors Faller, L.-M., Granig, W., Krivec, M., Abram, A., & Zangl, H.  IOP Journal of Micromechanics and Mircoengineering    2018  http://dx.doi.org/10.1088/1361-6439/aaadf4  
Book Multipath raytracing-based modelling of Time-of-Flight cameras: method and applications to semi-transparent and scattering media Marcus Baumgar, Norbert Druml & Cristina Consani IoSense Book, p 104-161   2019    
Book A Smart Phone based Virtual White ane Prototype featuring Time-of-Flight 3D Imaging Norbert Druml, Thomas Pietsch, Marcus Baumgar, Cristina Consani, Thomas Herndl, Gerald Holweg IoSense Book, p. 196-218   2019    
Book Sensor System Optimization under Uncertainty Wolfgang Granig, Lisa-Marie Faller, Hubert Zangl IoSense Book, p. 306-339   2019    
Book Sensor testing for Smart Mobility scenarios: From Parking Assistance to Automated Parking J. Murgoitio Larrauri, E.D. Martí Muñoz, M.E. Vaca Recalde, B. Hillbrand, A. Tengg, Ch. Pilz, N. Druml IoSense Book, p 355-392   2019    
Scientific Publication Sensor System Optimization to meet Reliability Targets Granig W., Faller L.-M., & Zangl H. Elsevier, Microelectronics Reliability   2018 http://dx.doi.org/10.1016/j.microrel.2018.06.005  
Publication in Conference proceedings/Workshop Statistical Modeling of Integrated Sensors for Automotive Applications. Granig W., Slimane A., & Zangl H. International Conference of Electrical and Electronic Technologies for Automotive   2018 http://dx.doi.org/10.23919/EETA.2018.8493172  
Scientific Publication Dependability Considerations of Redundant Sensor Systems Granig W., Hammerschmidt D., & Zangl H. Reliability Engineering and System Safety. Elsevier   2019 [Not Published Yet]  
Paper Time-of-Flight Cameras for Parking Assistance: A Feasibility Study Steinbaeck, J., Druml, N., Tengg, A., & Steger, C. H. ASDAM 2018, (pp. 215-218). Smolenice.   2018 doi:http://dx.doi.org/10.1109/ASDAM.2018.8544683 Open Access
Paper Secured Multi-Purpose Near Field Communication Interface for Robots using Components off the Shelf Ulz, T., Pieber, T., Steger, C., Haas, S., & Matischek, R. IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2018) [NOT YET PUBLISHED]. 2018, Madrid    
Publication in Conference proceedings/Workshop Automated Credential Derivation for the Secured Configuration of Devices in the Internet of Things Thomas Ulz, Thomas Pieber, Christian Steger, Andrea Höller, Sarah Haas, Rainer Matischek IEEE 20.09.-22.09.2017 Warsaw, Poland IEEE  
Publication in Conference proceedings/Workshop SecureConfig: NFC and QR-Code based Hybrid Approach for Smart Sensor Configuration. Thomas Ulz, Thomas Pieber, Christian Steger, Christian Lesjak, Holger Bock, Rainer Matischek IEEE RFID 2017 09.05.-11.05.2017 Phoenix, AZ, USA, 2017 IEEE Open Access
Publication in Conference proceedings/Workshop Bring Your Own Key for the Industrial Internet of Things Thomas Ulz, Thomas Pieber, Christian Steger, Sarah Haas, Holger Bock, Rainer Matischek IEEE ICIT 2017 22.3-25.3.2017 Toronto, Canada IEEE DOI: 10.1109/JRFID.2017.2745510 Open Access
Publication in Conference proceedings/Workshop Secured and Easy-to-Use NFC-Based Device Configuration for the Internet of Things Thomas Ulz, Thomas Pieber, Andrea Höller, Sarah Haas, Christian Steger IEEE Journal of Radio Frequency Identification 2017 2017 IEEE Open Access
Publication in Conference proceedings/Workshop Hardware-Secured Configuration and Two-Layer Attestation Architecture for Smart Sensors Thomas Ulz, Thomas Pieber, Christian Steger, Sarah Haas, Holger Bock, Rainer Matischek Euromicro DSD 2017 30.08.-01.09.2017 Vienna, Austria IEEE Open Access
Publication in Conference proceedings/Workshop  Hardware Secured, Password-based Authentication for Smart Sensors for the Industrial Internet of Things  Thomas Pieber, Thomas Ulz, Christian Steger, Rainer Matischek  NSS 2017 21.8-23.8.2017 Helsinki, Finnland Springer ISBN: 978-3-319-64700-5, DOI: 10.1007/978-3-319-64701-2_50 Open Access
 poster Eurosensors 2017 Marcus Baumgart, Markus Dielacher, Norbert Druml, Cristina Consani Simulating rain droplets influence on distance measurement with a Time-of-Flight camera sensor        
Talk at conference / Proceedings (ASDAM 2018) Modelling an Optical Time-of-Flight camera in OpticStudio and Python: method and applications M. Baumgart, N. Druml, M. Dielacher, C. Consani 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) – IEEE Explorer 21-24.10.2018 2018 IEEE Open Access
Publication in Conference proceedings / Workshop Fog effects on Time-of-Flight imaging investigated by ray-tracing simulations C. Consani, N. Druml, M. Dielacher, M. Baumgart Proceedings (Eurosensors 2018) 9-12.09.2018 2018 MDPI Open Access
Publication in Conference proceedings / Workshop (Eurosensors 2018) Investigating Intense Rainfall Influence on Distance Measurement with a Time-of-Flight Camera Sensor using Optical Ray-Tracing Simulation Technique M. Baumgart, N. Druml, M. Dielacher and C. Consani Proceedings 9-12.09.2018 2018 MDPI Open Access
Publication in Conference proceedings / Workshop PROCEDURE ENABLING SIMULATION AND IN-DEPTH ANALYSIS OF OPTICAL EFFECTS IN CAMERA-BASED TIME-OF-FLIGHT SENSORS M. Baumgart, N. Druml, C. Consani The International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences, Volume XLII-2, 2018 (ISPRS) 4-7.06.2018 2018   Open Access
Publication in Conference proceedings / Workshop Virtual White Cane featuring Time-of-Flight 3D Imaging supporting Visually Impaired Users N. Druml, T. Pietsch, M. Dielacher, C. Steger, M. Baumgart, C. Consani, T. Herndl, G. holweg 2018 21st Euromicro Conference on Digital System Design (DSD)   2018 IEEE  

Events and Exhibitions

Description Event Date Location Target Group Photos
The International Conference on Advanced Semiconductor Devices and Microsystems ASDAM 2018 devoted to the latest results of research and development in the field of new semiconductor devices and microsystems. Its goal was to bring together leading experts from institutes and universities as well as companies interested in the progress of high technology devices and microsystems. The Conference Proceedings will be published by the IEEE Electron Devices Society. ASDAM 2018 The 12th International Conference on Advanced Semiconductor Devices and Microsystems 21.10 – 24.10.2018 Bratislava, Slovakia Leading experts from institutes and universities  
Invited Talk: “Hardware-Based IoT Security: From Research to Practical Applications” IEEE 4th World Forum on Internet of Things 05.02.-08.02.2018 Singapore, SG Research and  Industry  
CLEO/Europe-EQEC is the largest, most comprehensive and prestigious gathering of optics and photonics researchers and engineers organized in Europe. European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference 2017 (CLEO/Europe-EQEC) 25.06.-29.06.2017 Munich, Germany    
SAE World Congress (now WCX: SAE World Congress Experience) is a full-sensory event experience that immerses you in the forefront of the automotive and mobility industries. SAE World Congress Experience (WCX) 04.04.-07.04.2017 Detroit, USA industry professionals, forward-thinking engineers, technicians, directors, and executives at the premier conference for your profession.  
“TrustworSys – Towards Trustworthiness for IoT Sensors” Thomas Pieber, TU Graz IoSense Spring School 2018 12.04.2018 Dresden, Germany PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies
“Time-of-Flight 3D Imaging and its Field of Applications”, Norbert Druml IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location  Addressed Topic Photos
CLEO/Europe-EQEC is the largest, most comprehensive and prestigious gathering of optics and photonics researchers and engineers organized in Europe. European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference (CLEO/Europe-EQEC) 25.06.-29.06.2017 Munich, Germany Optical simulation of Time-of-Flight sensor accuracy in rain  

Infineon Technologies Dresden GmbH (IFD)

Events and Exhibitions

Description Event Date Location Target Group Photos
Poster and Slides in Exhibition Area ECSEL JU Symposium 2017 June 13-14, 2017 Malta  European and global stakeholders in the Electronics Components and Systems field, including Industry, Research and Financial Communities, European, National and Regional decision-makers and international partners.
 The ENF is an important annual event for nanoelectronics stakeholders, from industry to academics and policy makers. Each year, the Forum attracts around 300 participants. In addition to the ENF event, a dedicated Workshop is organised for FP7 and Horizon 2020 project participants. Interested parties are also invited to compete in the “Competitive Electronics Innovation Award”. European Nanoelectronics Forum (ENF) 23.11.-24.11.2016 Rome, Italy  
General presentation of the IoSense project with posters of the project overview and two dedicated posters on demonstrators. European Forum for Electronic Components and Systems (EFECS) 05.12.-07.12.2017 Brussels, Belgium  
Keynote Dr. Oliver Pyper, Infineon Technologies Dresden and Project Coordinator IoSense “Sensing the world for IoT” IoSense Spring School 2018 12.04.2018 Dresden, Germany PhD students, industrial designers, technology scouts and project managers

Philips Lighting (PHILI)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
 Publication in Conference proceedings/Workshop Prognostics & Health Management for LED-based Applications   EuroSimE  3.4.-5.4.2017      
 Publication in Conference proceedings/Workshop Lumen maintenance prediction for LEDs – new insights.  Jacobs, B., van Driel, W., & Schuld, M. EuroSimE    2018, Toulouse  doi:http://dx.doi.org/10.1109/EuroSimE.2018.8369895  Open Access
 Publication in Conference proceedings/Workshop Color maintenance prediction for LED-based products. van Driel, W., Beijer, J., Bikker, J., van Blokland, C., Ankomah, C., & Jacobs, B. EuroSimE    2018, Toulouse doi:http://dx.doi.org/10.1109/EuroSimE.2018.8369875 Open Access
Book From Si towards SiC technology for Harsh Environment Sensing L.M. Middelburg, W.D. van Driel, G.Q. Zhang IoSense Book, p. 4-19   2019    
Book Health monitoring for Lighting Applications W.D. van Driel, L.M. Middelburg, B. El Mansouri, B.J.C. Jacobs IoSense Book, p 393-422   2019    
Book Ultraviolet Sensing in WBG – SiC B. El Mansouri, W.D. van Driel, G.Q. Zhang IoSense Book, p. 423-452   2019    

Events and Exhibitions

Description Event Date Location Target Group Photos
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Attending auditorium: industry and academia EuroSimE 2018 16.04.-18.04.2018 Toulouse, France Industry and academia  
Poster and hardware related to the IoSense demonstrator SmIght European Forum for Electronic Components and Systems (EFECS) 05.12.-07.12.2017 Brussels, Belgium    
“Prognostics & Health Management for LED-based Applications”, Willem Van Driel IoSense Spring School 2019 07.3.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Thales Alenia Space España, S.A. (TASE)

Events and Exhibitions

Description Event Date Location Target Group Photos
“R-ICU: Reconfigurable Instrument Control Unit use-case: MarsExploration Rovers”, Marcos Martínez Alejandro IoSense Spring School 2019 07.3.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Research and Technology Organization (PRO)

Austrian Institute of Technology (AIT)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
 Paper  Analyzing Computer Vision Data – The Good, the Bad and the Ugly  Oliver Zendel, Katrin Honauer, Markus Murschitz, Martin Humenberger, Gustavo Fernandez Dominguez  The IEEE Conference on Computer Vision and Pattern Recognition (CVPR), pp. 1980-1990    2017 IEEE Open Access
Paper Safety and Security in a Smart Production Environment (R. Kloibhofer) Kloibhofer Reinhard, Kristen Erwin, & Jakšić Stefan Springer LNCS 11094, SAFECOMP Workshop Proceedings, p. 190-201,   2018 Springer, ISBN 978-3-319-99228-0 Open Access
Publication in Conference proceedings Exponential pattern recognition for deriving air change rates from CO2 data Wenig, Florian; Klanatsky, Peter; Heschl, Christian; Cristinel Mateis; Nickovic Dejan 2017 IEEE 26th International Symposium on Industrial Electronics (ISIE), pp. 1507-1512 27.9-29.9.17  Edinburgh, 2017  doi: 10.1109/ISIE.2017.8001469 Open Access
Publication in Conference proceedings Smart Systems Everywhere–how much smartness is tolerable? Erwin Schoitsch IDIMT 2017, p. 361-374 2017 Linz, Austria, 2017 DOI: 10.5281/zenodo.1043960 Open Access
Publication in Conference proceedings Smart Systems Everywhere – Intelligence, Autonomy, Technology and Society Erwin Schoitsch IDIMT 2018, p. 153-165 2018 Linz, Austria, 2018 DOI: 10.5281/zenodo.2590949 Open Access
Publication in Conference proceedings An Algebraic Framework for Runtime Verification S. Jaksic, E. Bartocci, R. Grosu, and D. Nickovic CoRR 2018     Open Access

Events and Exhibitions

Description Event Date Location Target Group Photos
 Presentation  2017 IEEE 26th International Symposium on Industrial Electronics  June 16-June 21st 2017 Edinburgh, Scotland, UK    
“TrustWorSys: Secured Smart Production”, Reinhard Kloibhofer IoSense Spring School 2019 07.03.
2019
Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location  Addressed Topic Photos
Presentation: Digitizing European Industry – current Standardization and European Research (E. Schoitsch, R. Kloibhofer et.al.) ERCIM Workshop “Digital Twins” at ECSS (European Computer Systems Summit) 09.10.2018 Gothenburg, Sweden IoSENSE Use Case “TrustWorSyst”  
Int. Conference on Computer Safety, Reliability and Security SAFECOMP 2018 18.-21.9. 2018 Västeras, Sweden IoSENSE Poster and Flyer at AIT Booth  
Euromicro Conferences SEAA (SW Enginering) and DSD (Digital System Design) Euromicro 2018 29.-31.8. 2018 Prague, CZ IoSENSE Poster at Poster session and booth  
Interdisciplinary Information Management Talk IDIMT 2018 5.-7.9. 2018 Nova Kutna, CZ IoSENSE Flyer distribution  
Microelectronic Systems Symposium MESS 18 12.-13.4. 2018 Vienna IoSENSE Poster and Flyer  
Cyber-physical Systems Week CPS Week 2018 10.-13.4. 2018 Porto, Portugal IoSENSE Flyer distribution  
IoT Week IoT Week 2018 5.-7.6. 2018 Bilbao, Spain IoSENSE Flyer distribution  
Safety and Security of complex systems and applications Safety meets Security 2018 14.03.2018 Nürtingen (Stuttgart) IoSENSE Flyer distribution  

Estatal Consejo Superior de Investigaciones Científicas (CSIC)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Article Consensus-Based Cooperative Control Based on Pollution Sensing and Traffic Information for Urban Traffic Networks Antonio Artuñedo; Raúl M. del Toro and Rodolfo E. Haber Sensors  21.4.17 Sensors 2017, 17(5), 953; doi:10.3390/s17050953 MDPI  Open Access
Article Obstacle Recognition Based on Machine Learning for On-Chip LiDAR Sensors in a Cyber-Physical System Fernando Castaño; Gerardo Beruvides; Rodolfo E. Haber and Antonio Artuñedo Sensors 12.9.2017 Sensors 2017,17(9), doi: 10.3390/s17092109. MDPI  Open Access
Article Time-To-Failure Modelling in On-Chip LiDAR Sensors for Automotive Applications Fernando Castaño, Gerardo Beruvides, Rodolfo E. Haber, and Alberto Villalonga Proceedings 29.11.2017 Proceedings 2017, 1(8), 809; https://doi.org/10.3390/proceedings1080809 MDPI Open Access
Article A Simple Multi-Objective Optimization based on the Cross-Entropy Method Rodolfo E. Haber; Gerardo Beruvides; Ramón Quiza and  Alejandro Hernandez IEEE Access 17.10.2017 IEEE Access 2017, PP(99) IEEE  Open Access
Article Coping with Complexity When Predicting Surface Roughness in Milling Processes: Hybrid Incremental Model with Optimal Parametrization Gerardo Beruvides, Fernando Castaño, Rodolfo E. Haber, Ramón Quiza, and Alberto Villalonga Complexity 17.12.2017 Vol. 2017, ID 7317254, 11 pages Hindawi  Open Access
Article Self-Tuning Method for Increasing Reliability in Obstacle Detection based on Internet-of-Things LiDAR Sensor Models Fernando Castaño, Gerardo Beruvides, Alberto Villalonga, Rodolfo Haber Sensors 10.5.2018 Sensors 2018, 18(5), 1508; https://doi.org/10.3390/s18051508 MDPI Open Access
Article Smart Sensing of Pavement Temperature Based on Low-Cost Sensors and V2I Communications Jorge Godoy, Rodolfo Haber, Juan Jesús Muñoz, Fernando Matia and Álvaro García Sensors 29.6.2018 Sensors 2018, 18(7), 2092; https://doi.org/10.3390/s18072092 MDPI Open Access
Article Condition-based Monitoring Architecture for CNC Machine Tools based on Global Knowledge Villalonga, A., Beruvides, G., Castaño, F., & Haber, R. E. 16th IFAC Symposium on Information Control Problems in Manufacturing (INCOM2018)   Bergamo, 2018 doi:http://dx.doi.org/10.1016/j.ifacol.2018.08.259 Open Access
Article Industrial Cyber-Physical System for Condition-based Monitoring in Manufacturing Processes. Villalonga, A., Beruvides, G., Castaño, F., & Haber, R. 1st IEEE International Conference on Industrial Cyber-Physical Systems (ICPS-2018).   2018, Saint Petersburg doi:http://dx.doi.org/10.1109/ICPHYS.2018.8390780 Open Access
Article Self‐Tuning Reliability Methodology based on Internet‐of‐Things LiDAR Sensor Models for Obstacle Detection. Castaño, F., Beruvides, G., Villalonga, A., & Haber, R. E. Sensors (MDPI)   2018 DOI: 10.3390/s18051508 Open Access
Book Computational intelligence for simulating a LiDAR sensor (Cyber-Physical and Internet of Things automotive applications) Fernando Castaño, Gerardo Beruvides, Alberto Villalonga and Rodolfo E. Haber IoSense Book, p 162-195   2019    

Events and Exhibitions

Description Event Date Location Target Group Photos
INCOM 2018 aims to provide a context facilitating the knowledge exchange, the review and discussion of theoretical advances, research results, and industrial experiences, among scientists, researchers, decision makers, practitioners and students. 16th IFAC Symposium on Information Control Problems in Manufacturing (INCOM) 27.06.-28.06.2018 Bergamo, Italy    
Presentation on “Industrial Cyber-Physical System for Condition-based Monitoring in Manufacturing Processes” 1st IEEE International Conference on Industrial Cyber-Physical Systems 2018 (ICPS) 15.05.-18.05.2018 Saint Petersburg, Russia Academic  
Poster at Open Days Science Week 2017 6-19.11.2017 Madrid (Spain) Dissemination of CSIC contributions in Iosense
Poster exhibition: Time-To-Failure Modelling in On-Chip LiDAR Sensors for Automotive Applications 5th International Symposium on Sensor Science (i3S) 27.09.-29.09.2017 Barcelona, Spain  
Poster at RoboCity16: Robots for Citizens Open Conference on Future Trends in Robotics 26-27.5.2016 Madrid (Spain) Dissemination of CSIC contributions in Iosense: President of the Spanish Government
“Real-time Dynamic Local Map (DLM) generation for driving assistance using only LiDAR data. Application to a co-simulation traffic scenario”, Fernando Castano Romero IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies  
Poster “Real-time Dynamic Local Map (DLM) generation for driving assistance using only LiDAR data. Application to a co-simulation traffic scenario” IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location Addressed Topic Photos
Poster Exhibition 5th International Symposium on Sensor Science (i3S2017) 27-29.9.2017 Barcelona (Spain) Time-To-Failure Modelling in On-Chip LiDAR Sensors for Automotive Applications
Oral Presentation ARTEMIS Technology Conference 2016 4-5.10.2016 Madrid (Spain) Simulation Model and Verification of Sensors for IoT ecosystems  
Poster Exhibition ECSEL Call Forum 2018 06-07.3.2018 Warsaw (Poland) GAMHE 4.0: Engineering the Intelligence  
Oral presentation 1st IEEE International Conference on Industrial Cyber-Physical Systems (ICPS2018) 15-18.5.2018 Saint Petersburg (Russia) Industrial Cyber-Physical System for Condition-based Monitoring in Manufacturing Processes  
Oral presentation 16th 2018 IFAC Symposium on Information Control Problems in Manufacturing (INCOM 2018) 11-13.6.2018 Bergamo (Italy) Condition-based Monitoring Architecture for CNC Machine Tools based on Global Knowledge Massive MIMO for Estimation of a Correlated Source Vector in Sensor Networks  

Carinthian Tech Research AG (CTR)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
 Peer-reviewed  Sintering Strategies for Inkjet Printed Metallic Traces in 3D Printed Electronics, Journal of flexible and printed electronics  A. Roshanghias, M. Krivec, M. Baumgart  Journal of Flexible and Printed Electronics 26.09.2017 Bristol BS1 6HG, UK (2017) IOP Publishing  Open Access
Publication in Conference proceedings / Workshop (CLEO2017) Optical simulation of Time-of-Flight sensor accuracy in rain M. Baumgart, C. Consani, M. Dielacher, N. Druml 2017 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC) 25.06.2017 2017 IEEE Open Access
Publication in Conference proceedings/Workshop Modelling and Optical Time-of-Flight cameras in OpticStudio and Python: method and aplications Baumgart, M., Druml, N., Dielacher, M., & Consani, C. ASDAM 2018, (pp. 219-220).    2018 doi:http://dx.doi.org/10.1109/ASDAM.2018.8544507   Open Access
Poster at a conference (no proceedings) (CPES 2017) Sintering Strategies of Complex Conductive Traces for Flexible Printed Electronics: Ohmic Heating Combined with Photonic Curing      24.5-26.5.2017      
Publication in Conference proceedings / Workshop (Eurosensors 2017) 3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping M. Krivec, A. Roshanghias, A. Binder Proceedings 3-6.09.2017 2017 MDPI Open Access
Publication in Conference proceedings / Workshop (Eurosensors 2017) Simulating rain droplets influence on distance measurement with a Time-of-Flight camera sensor M. Baumgart, M. Dielacher, N. Druml, C. Consani Proceedings 3-6.09.2017 2017 MDPI Open Access
Publication in Conference proceedings / Workshop Safety-Critical Human Detection featuring Time-of-Flight Environment Perception N. Druml, B.Rutte-Vas, S. Wilfing, C. Consani, M Baumgart, T. Herndl, G. holweg 2017 22nd IEEE International Conference on Emerging Technologies and Factory Automation (ETFA)   2017 IEEE  
Publication in Conference proceedings / Workshop Virtual White Cane featuring Time-of-Flight 3D Imaging supporting Visually Impaired Users N. Druml, T. Pietsch, M. Dielacher, C. Steger, M. Baumgart, C. Consani, T. Herndl, G. holweg 2018 21st Euromicro Conference on Digital System Design (DSD)   2018 IEEE  
Publication in Conference proceedings / Workshop (ISPRS Tech. Comm. II Symposium 2018) PROCEDURE ENABLING SIMULATION AND IN-DEPTH ANALYSIS OF OPTICAL EFFECTS IN CAMERA-BASED TIME-OF-FLIGHT SENSORS M. Baumgart, N. Druml, C. Consani The International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences, Volume XLII-2, 2018 4-7.06.2018 2018   Open Access
Publication in Conference proceedings / Workshop (Eurosensors 2018) Investigating Intense Rainfall Influence on Distance Measurement with a Time-of-Flight Camera Sensor using Optical Ray-Tracing Simulation Technique M. Baumgart, N. Druml, M. Dielacher and C. Consani Proceedings 9-12.09.2018 2018 MDPI Open Access
Publication in Conference proceedings / Workshop (Eurosensors 2018) Fog effects on Time-of-Flight imaging investigated by ray-tracing simulations C. Consani, N. Druml, M. Dielacher, M. Baumgart Proceedings 9-12.09.2018 2018 MDPI Open Access
Talk at conference / Proceedings (ASDAM 2018) Modelling an Optical Time-of-Flight camera in OpticStudio and Python: method and applications M. Baumgart, N. Druml, M. Dielacher, C. Consani 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) – IEEE Explorer 21-24.10.2018 2018 IEEE Open Access
 poster Eurosensors 2017 Marcus Baumgart, Markus Dielacher, Norbert Druml, Cristina Consani Simulating rain droplets influence on distance measurement with a Time-of-Flight camera sensor        
Book Multipath raytracing-based modelling of Time-of-Flight cameras: method and applications to semi-transparent and scattering media Marcus Baumgar, Norbert Druml & Cristina Consani IoSense Book, p 104-161   2019    
Book A Smart Phone based Virtual White Cane Prototype featuring Time-of-Flight 3D Imaging Norbert Druml, Thomas Pietsch, Marcus Baumgar, Cristina Consani, Thomas Herndl, Gerald Holweg IoSense Book, 196-218   2019    

Events and Exhibitions

Description Event Date Location Target Group Photos
The International Conference on Advanced Semiconductor Devices and Microsystems ASDAM 2018 devoted to the latest results of research and development in the field of new semiconductor devices and microsystems. Its goal was to bring together leading experts from institutes and universities as well as companies interested in the progress of high technology devices and microsystems. The Conference Proceedings will be published by the IEEE Electron Devices Society. ASDAM 2018 The 12th International Conference on Advanced Semiconductor Devices and Microsystems 21.10 – 24.10.2018 Bratislava, Slovakia Leading experts from institutes and universities  
ISPRS TC II focuses, at various scales, on geometric, radiometric and multi-temporal aspects of image- and range-based 3D surveying and modeling. Specifically Commission II deals with image orientation, point cloud generation and processing, 3D feature extraction, scene understanding, sensor and data fusion, sensor characterization, machine learning for geospatial data analysis and big data techniques for massive data processing. ISPRS Technical Commission II Symposium 2018 04.06.-07.06.2018 Riva del Garda, Italy    
The 2017 IEEE International Conference on RFID is the premier conference for exchanging all technical research in RFID  IEEE International Conference on RFID 2017  09.05.-11.05.2017 Phoenix, Arizona, USA  Academic  
CPES is Canada’s premier conference and trade show exhibition for printable, flexible and wearable electronics. CPES 2017 printable flexible wearable electronics symposium 24.05.-26.05.2017 Toronto, Canada Academic  
CLEO/Europe-EQEC is the largest, most comprehensive and prestigious gathering of optics and photonics researchers and engineers organized in Europe. European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference 2017 (CLEO/Europe-EQEC) 25.06.-29.06.2017 Munich, Germany Academic  
Eurosensors Conference is a unique forum for scientists and engineers from academia, research institutes and industry to present their latest results in the field of Sensors, Actuators, Microsystems and Nanosystems. Eurosensors 2017 03.09.-06.09.2017 Paris, France Academic  

Workshop and Conferences

Description Event Date Location  Addressed Topic Photos
Poster presentation at the conference CPES 2017 printable flexible wearable electronics symposium 24.5.-26.5.2017  Toronto (Canada)  Sintering Strategies of Complex Conductive Traces for Flexible Printed Electronics: Ohmic Heating Combined with Photonic Curing  
The 2017 IEEE International Conference on RFID is the premier conference for exchanging all technical research in RFID. The conference attendance boasts an outstanding mix of practitioners and researchers from industry and academia. IEEE International Conference on RFID 09.05.-11.05.2017 Phoenix, USA industry and academia  
Poster presentation at the conference CLEO Europe  25.6.-29.6.2017 Munich (Germany) Optical simulation of Time-of-Flight sensor accuracy in rain  
 Poster presentation at the conference, proceedings paper  Eurosensors 2017  03.09.-06.09.2017  Paris (France)  3DInkPack – Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping  
Poster presentation at a conference ISPRS Tech. Comm. II Symposium 2018 4-7.06.2018 Riva del Garda PROCEDURE ENABLING SIMULATION AND IN-DEPTH ANALYSIS OF OPTICAL EFFECTS IN CAMERA-BASED TIME-OF-FLIGHT SENSORS  
Poster presentation at a conference Eurosensors 2018 9-12.09.2018 Graz Investigating Intense Rainfall Influence on Distance Measurement with a Time-of-Flight Camera Sensor using Optical Ray-Tracing Simulation Technique  
Poster presentation at a conference Eurosensors 2018 9-12.09.2018 Graz Fog effects on Time-of-Flight imaging investigated by ray-tracing simulations  
Oral presentation at a conference ASDAM 2018 21-24.10.2018 Smolenice Modelling an Optical Time-of-Flight camera in OpticStudio and Python: method and applications  
 Poster presentation at the conference, proceedings paper  Eurosensors 2017   03.09.-06.09.2017   Paris (France)  Simulating rain droplets influence on distance measurement with a Time-of-Flight camera sensor  

Centre Tecnologic de Telecomunicacions de Catalunya (CTTC)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Journal Connectivity Analysis in Clustered Wireless Sensor Networks Powered by Solar Energy Prodromos-Vasileios Mekikism Elli Kartsakli, Angelos Antonopoulos, Luis Alonso, Christos Verikoukis IEEE Transactions on Wireless Communications  January 2018   IEEE   Open Access
Journal COPS: Cooperative Statistical Misbehavior Mitigation in Network-Coding-aided Wireless Networks Angelos Antonopoulos and Christos Verikoukis IEEE Transactions on Industrial Informatics  September 2017    IEEE  Open Access
Publication in Conference proceedings Harvesting artificial light indoors to power perpetually a Wireless Sensor Network node David Pubill, Jordi Serra and Christos Verikoukis IEEE International Wokshop on Cumputer-Aided Modeling Analysis and Design of Communication Links and Networks (CAMAD 2018) 17-19 September 2018 Barecelona (Spain) IEEE  Open Access
Publication in Conference proceedings Quality of Service Provisioning in High-Capacity 5G Fronthaul/Backhaul Networks J. Vardakas, E. Kartsakli, A. Antonopoulos, S. Papaioannou, G. Kalfas, N. Pleros, C. Verikoukis IMCL2017 30 November-1 December 2017 Thessaloniki (Greece)    Open Access
Publication in Conference proceedings/Workshop Distributed Massive MIMO for Estimation of a Correlated Source Vector in Sensor Networks Jordi Serra, David Pubill and Christos Verikoukis IEEE ISSPIT2017  18-20 December 2017  Bilbao (Spain)  IEEE  Open Access
Publication in Conference proceedings Implementation of an SDN-enabled 5G Experimental Platform for Core and Radio Access Network Support K. Ramantas, E. Kartsakli, M. Irazabal, A. Antonopoulos, C. Verikoukis IMCL2017 30 November-1 December 2017 Thessaloniki (Greece)    Open Access
Journal Countering Intelligent Dependent Malicious Nodes in Target Detection Wireless Sensor Networks S. Althunibat, A. Antonopoulos, E. Kartsakli, F. Granelli, C. Verikoukis IEEE Sensors December 2016   IEEE  Open Access
Publication in Conference proceedings Misbehavior Detection in the Internet of Things: A Network-Coding-aware Statistical Approach A. Antonopoulos, C. Verikoukis IEEE INDIN 18-21 July 2016 Futuroscope-Poitiers (France) IEEE  Open Access
Book Power consumption minimization of Wireless Sensor Networks in the Internet of Things era Jordi Serra, David Pubill and Christos Verikoukis. IoSense Book, p 219-246   2019 Springer  

Events and Exhibitions

Description Event Date Location Target Group Photos
Themed “Gateway to a Connected World,” the conference will offer five full days of original paper presentations, tutorials, workshops, keynotes, demonstrations, industry sesions and social events designed to further career opportunities and the in-depth understanding of the latest communications advancements worldwide IEEE Globecom 2018 09.12.-13.12.2018 Abu Dhabi (UAE) Academic  
Worldwide leading event for smart cities. Target group: Governments and public administration, public or private institutions, researchers and academics, global companies, small and medium enterprises, start-ups and entrepreneurs Smart City Expo World Congress 2018 (SCEWC) 13-15 November 2018 Barcelona (Spain) Professional industry visitors  
The IOTSWC was focused on the main industries that are impacted by IoT today: Manufacturing, energy and utilities, connected transport, healthcare, buildings and infrastructure, and open industry. IoT Solutions World Congress 2018 (IOTSWC) 16-18 October 2018 Barcelona(Spain) Professional industry visitors  
Stand at MWC18 – Dissemination of IoSense activities Mobile World Congress 2018 (MWC18) 26th February – 1st March 2018 Barcelona (Spain) Professional industry visitors  
 Stand in the pavilion of the Regional Government of Catalonia – Dissemination of IoSense activities  Smart City Expo World Congress 2017 (SCEWC17)  14th – 16th November 2017  Barcelona (Spain) Professional industry visitors
Stand in the pavilion of the Regional Government of Catalonia – Dissemination of IoSense activities IoT Solutions World Congress 2017 (IOTSWC17)  3rd – 5th October 2017  Barcelona (Spain) Professional industry visitors
 Stand at MWC17 – Dissemination of IoSense activities Mobile World Congress 2017 (MWC17) 27th February – 2nd March 2017  Barcelona (Spain) Professional industry visitors  
Communications Society’s Technical Committees are intended to “define and implement the technical directions of the Society”. As a fundamental element of the Society all members are invited – and encouraged – to participate in one or more of its technical committees. IEEE Communications Systems Integration and Modeling (CSIM) Technical Committee 21.05.-25.05.2017 Paris(France)  Academia  
CAMAD provides a forum for discussion of recent developments on analytical and simulation tools and techniques for the performance evaluation of communications systems. IEEE CAMAD 2017 19.06.-21.06.2017 Lund(Sweden) Academia  
IEEE Global Communications Conference (GLOBECOM) is one of the IEEE Communications Society’s two flagship conferences dedicated to driving innovation in nearly every aspect of communications. IEEE Globecom 2017 04.12.-08.12.2017 Singapore Academia  
CO2 Monitoring System was presented Smart City Expo World Congress 2016 (SCEWC16) 15th – 17th November 2016  Barcelona (Spain) Professional industry visitors
Stand in the pavilion of the Regional Government of Catalonia (CTTC took the opportunity to publicize the main activities that are being carried out in the IoSENSE project. And, in particular, the participation of the CTTC in the demonstrator AdCon (Advanced Control for energy efficient Smart Energy Systems) was explained.)  IoT Solutions World Congress 2016 (IOTSWC16)  25th – 27th October 2016  Barcelona (Spain) Professional industry visitors

Workshop and Conferences

Description Event Date Location  Addressed Topic Photos
International Workshop on Computer-Aided Modeling Analysis and Design of Communication Links and Networks IEEE CAMAD 17-19 September 2018 Barcelona (Spain)  Communication, Network, Modelling  
IEEE Global Communications Conference (GLOBECOM) is one of the IEEE Communications Society’s two flagship conferences dedicated to driving innovation in nearly every aspect of communications  IEEE Globecom  December 4th – 8th 2017  Singapore  Communication, Global Hub, Telecommunication  
International Workshop on Computer-Aided Modeling Analysis and Design of Communication Links and Networks  IEEE CAMAD  June 19th – 21th 2017  Lund (Sweden)  Communication, Network, Modelling  
IEEE International Conference on Communications  IEEE ICC  May 21th – 25th 2017  Paris (France)  Communication, Industry  
 Poster presentation at the conference, proceedings paper  Eurosensors 2017   03.09.-06.09.2017   Paris (France)  Simulating rain droplets influence on distance measurement with a Time-of-Flight camera sensor  

Fachhochschule Burgenland GmbH (FB)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Publication in Conference proceedings Exponential pattern recognition for deriving air change rates from CO2 data Wenig, Florian; Klanatsky, Peter; Heschl, Christian; Cristinel Mateis; Nickovic Dejan 2017 IEEE 26th International Symposium on Industrial Electronics (ISIE), pp. 1507-1512 27.9-29.9.17  Edinburgh, 2017  doi: 10.1109/ISIE.2017.8001469 Open Access

Events and Exhibitions

Description Event Date Location Target Group Photos
 Industry experts, researchers and academics are expected to gather together to share ideas and experiences surrounding frontier technologies, breakthroughs, innovative solutions, research results, as well as initiatives related to industrial electronics and their applications.  2017 IEEE 26th International Symposium on Industrial Electronics  June 16-June 21st 2017 Edinburgh, Scotland, UK    
Poster and video clip explaining innovation aspects of the IoSense demonstrator AdCon European Forum for Electronic Components and Systems 2017 (EFECS) 05.12.-07.12.2017 Brussels, Belgium  
“AdCon: Value of IoT Sensors in Energy Efficient Buildings”, Prof. Christian Heschl IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies
Poster “AdCon: Value of IoT Sensors in Energy Efficient Buildings” IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location  Addressed Topic Photos
 Conference participation  2017 IEEE 26th International Symposium on Industrial Electronics  27.9-29.9.17  Edinburgh, UK  Industrial Electronics
Poster and video clip explaining innovation aspects of the IoSense demonstrator AdCon European Forum for Electronic Components and Systems (EFECS) 05.12.-07.12.2017 Brussels, Belgium    
E-nova International Conference Conference 22-23 November 2018 Pinkafeld Austria ‘Building of the future – interconnected – digital – eco-social’.

Fraunhofer ENAS (FGH)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Publication in Conference proceedings/Workshop Nanoindentation and Coupled Finite Element Analysis for Robustness and Design Evaluation of MEMS-Microphones Albrecht, J., Weissbach, M., Vobl, M., Krumbein, U., & Rzepka, S. ASDAM 2018    2018 ISBN 978-1-5386-7488-8  
Publication in Conference proceedings/Workshop Mechanical Characterization of MEMS-Microphones by Means of Nanoindentation and Coupled Finite Element Analysis Albrecht, J., Weissbach, M., Vobl, M., Krumbein, U., & Rzepka, S. Electronics Packaging Technology Conference (EPTC). [NOT YET PUBLISHED] 2018    
Book Reliability of IoT sensor systems: New methods for the efficient and comprehensive reliability assessment J. Albrecht, G. Gadhiya, S. Rzepka IoSense Book, p. 340-354   2019    

Events and Exhibitions

Description Event Date Location Target Group Photos
Poster and Slides in Exhibition Area ECSEL JU Symposium 2017 June 13-14, 2017 Malta European and global stakeholders in the Electronics Components and Systems field, including Industry, Research and Financial Communities, European, National and Regional decision-makers and international partners.
“Virtual Prototyping for Shortest Time-to-Market of New IoT Products” (Focus: Design for Reliability) Prof. Sven Rzepka IoSense Spring School 2018 12.04.2018 Dresden, Germany PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies

Fraunhofer IPMS (FGH)

Events and Exhibitions

Description Event Date Location Target Group Photos
Presentation RFID RAIN Member Meeting 06.-08.03.2018 Mountain View, USA RFID Solutions  
Exhibition & Presentation RFID & IoT-Tomorrow 30.-31.10.2018 Darmstadt RFID Solutions  
Exhibition SPS IPC Drivers 27.-29.11.2018 Nürnberg Industry
Exhibition Embedded World 27.02.-01.03.2018 Nürnberg Electronics  
Presentation at Exhibition IDTech EX 04.12.2018 Berlin Innovation  
“Passive RFID Sensors – Battery-Free, Wireless Pressure Measurements” Dr. Andreas Weder, Team Manager of Module Integration Group IoSense Spring School 2018 12.04.2018 Dresden, Germany PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location Addressed Topic Photos
IOSense Spring School Presentation SSI Conference 2018-04-11 Dresden Passive RFID Sensors  

Interuniversity Microelectronics Centre (IMEC)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
 Paper Post processing of a SiN-based photonic stack above a CMOS imager sensor Pham, N. P., Du Bois, B., Van Hoof, R., Winderickx, G., Tyagi, H. K., Sabuncuoglu, D., & Tilmans, H. A. Electronics Packaging Technology Conference (EPTC 2018)  NOT YET PUBLISHED  2018, Singapore    
Book Integrated Photonic Microsystems J. Kjellman, N. Hosseini, Jeong Hwan Song, T. Tongnyuy, S. Dwivedi, B. Troia, B. Figeys, S. Kerman, A. Stassen, P. Neutens, S. Severi, R. Jansen, P. Soussan, S.S. Saseendran, A. Marinins, X. Rottenberg IoSense Book, p. 453-474   2019    

Events and Exhibitions

Description Event Date Location Target Group Photos
Press release: Raman-on-Chip for High-Throughput, High-Resolution Handheld Spectroscopy SPIE BIOS 2019 expo 2-7 February, 2019 San Francisco, USA Users and manufacturers of Raman spectrometers  
Poster and Slides in Exhibition Area ECSEL JU Symposium 2017 June 13-14, 2017 Malta European and global stakeholders in the Electronics Components and Systems field, including Industry, Research and Financial Communities, European, National and Regional decision-makers and international partners.
“HiThRaSpect: High Throughput Raman Spectrometer”, Harrie Tilmanns IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location  Addressed Topic Photos
Oral presentation and paper in conference proceedings 2018 20th Electronics Packaging Technology Conference (IEEE EPTC2018) 4-7 December, 2018 Hard Rock Hotel Singapore, Singapore Post processing of a SiNy-based photonic stack above a CMOS imager sensor  
Oral presentation SPIE Photonics West BIOS 2019 2-7 February, 2019 San Francisco (CA), USA High-optical-throughput high-spectral-resolution on-chip Raman spectrometer

Materials Center Leoben (MCL)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Publication CuO Thin Films Functionalized with Gold Nanoparticles for Conductometric Carbon Dioxide Gas Sensing.   Chemosensors 2018, 6, 56. doi: 22.11.2018 2018 doi: 10.3390/chemosensors6040056  
Book Electro-Thermal-Mechanical modelling of gas sensor hotplates Raffaele Coppeta, Ayoub Lahlalia, Darjan Kozic, René Hammer, Johann Riedler, Gregor Toschkof, Anderson Singulani, Zeeshan Ali, Martin Sagmeister, Sara Carniello, Siegfried Selberher, Lado Filipovic IoSense Book, p. 20-82   2019    
proceeding Exploring Temperature-Modulated Operation Mode of Metal Oxide Gas Sensors for Robust Signal Processing   Eurosensors 2018 20.11.2018 2018 doi:10.3390/proceedings2131058  
Publication Exploring wavelet coefficients as robust features in TCO MOx gas sensor signal processing. Boiger, R., Defregger, S., Grbic, M., Köck, A., Mücke, M., Wimmer-Teubenbacher, R., & Zaragoza Travieso, B. Eurosensors 2018 Conference on Digital System Design (DSD) [NOT YET PUBLISHED]. 2018, Graz    

Workshop and Conferences

Description Event Date Location Addressed Topic Photos
Exploring temperature-modulated operation mode of metal oxide gas sensors for signal processing Eurosensors2018 9.9 -12.9.2018 Graz/Austria Temperatur modulated gas sensor operationg  
Temperature modulated operation of SnO2 – based gas sensor arrays ASDAM 22.10 – 25.10.2018 Smolenice/Slovakia Gas sensor arrays  
CMOS integrable Metal-oxide based CO2gas sensing Current and future air pollution management 2.9 – 7.9 2018 Sandbjerg /Danmark CO2-gas sensing  
Temperature modulated operation of metal oxide gas sensors Current and future air pollution management 2.9 -7.9 2018 Sandbjerg /Danmark Temperature modulated gas sensor operation  
Advanced technology processes for manufacturing of SnO2 and NiO based gas sensors and their properties ASDAM 22.10 – 25.10.2018 Smolenice/Slovakia Advanced manufacturing technology  
Multifunctional Nanoparticles – Key for Optimizing Chemical Nanosensors ASDAM 22.10 – 25.10.2018 Smolenice/Slovakia Gas sensors Optimization  
AdCon SME Workshop in course of e.nova 2018 E-Nova 22.11.- 23.11.2018 Pinkafeld/Austria AdCon Demonstrator presentation

Slovak University of Technology (STUBA)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Scientific Publication Cu2O Based Gas Sensor Prepared by Electrodeposition Mikolášek, M., Ondrejka, P., Chymo, F., Řeháček, V., Predanocy, M., Kostič, I., & Hotový, I.  ASDAM 2018. pp. 221-224. Smolenice: IEEE.    2018 ISBN 978-1-5386-7488-8  Open Access
Scientific Publication Novel Cu2O gas sensor prepared by potentiostatic electrodeposition on IDE electrodes Mikolasek, M., Meri, J., Chymo, F., Ondrejka, P., Rehacek, V., Predanocy, M., Hotovy, I. IOP Science Journal of Physics: Conference Series (JPCS) [NOT YET PUBLISHED] 2018    
Scientific Publication NiO gas sensing element prepared on needle-shaped silicon substrate. Predanocy, M., Hotový, I., Mikolášek, M., Botcher, R., & Spiess, L. IOP Science Journal of Physics: Conference Series (JPCS) [NOT YET PUBLISHED] 2018    

Fundación TECNALIA Research & Innovation (TECNALIA)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Publication in Conference proceedings/Workshop  A Complete Framework for Developing and Testing Automated Driving Controllers  RayLattarulo, Joshu ́eP ́erez, MartinDendaluce IFAC  9.7-12.7.2017      Open Access
Publication in Conference proceedings/Workshop Adaptable emergency braking based on a fuzzy controller and a predictive model  Alarcon, L. G., Recalde, M. E., Marcano, M., & Marti, E. IEEE International Conference on Vehicular Electronics and Safety (ICVES)    2018 doi:10.1109/ICVES.2018.8519586   Open Access
Book Sensor testing for Smart Mobility scenarios: From Parking Assistance to Automated Parking   Sensor Systems Simulations: From Concept to Solution In progress 2019 ELSEVIER  
Paper Car parking assistance based on Time-of-Flight camera   10th IAV 2019 (Intelligent Autonomous Vehicles) In progress 2019 IEEE  
Book Sensor testing for Smart Mobility scenarios: From Parking Assistance to Automated Parking J. Murgoitio Larrauri, E.D. Martí Muñoz, M.E. Vaca Recalde, B. Hillbrand, A. Tengg, Ch. Pilz, N. Druml IoSense Book, p 355-392   2019    

Events and Exhibitions

Description Event Date Location Target Group Photos
Poster and Slides in Exhibition Area ECSEL JU Symposium 2017 June 13-14, 2017 Malta European and global stakeholders in the Electronics Components and Systems field, including Industry, Research and Financial Communities, European, National and Regional decision-makers and international partners.
“From Parking Assistance to Automated Parking using a Time-Of-Flight Camera” Jesus Murgoitio IoSense Spring School 2018 12.04.2018 Dresden, Germany PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies
“Parking assistance based on ToF camera”, Enrique David Marti IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies
“Smability demonstrator (Automated Parking)”, Murgoitio Larrauri, Jesus IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies  
Poster “Smability demonstrator (Automated Parking)” IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location  Addressed Topic Photos
10th IFAC Symposium on Intelligent Autonomous Vehicles IAV 2019 3-5/Jul/2019 Gdansk (Poland) Intelligent Autonomous Vehicles (Smart Mobility: Smability) Web page: iav2019

Delft University of Technology (TU-Delft)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Conference Designing a 100 [aF/nm] capacitive transducer L. M. Middelburg, B. El Mansouri, R. H. Poelma, H. W. van Zeijl, J. Wei, G. Q. Zhang, W. D. van Driel Eurosim 2018-04-15 2018 IEEE Open Access
Conference Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications L.M. Middelburg, B. El Mansouri, Rene Poelma, G.Q. Zhang, Henk Van Zeijl, Jia Wei IEEEsensors 2018-10-28 2018 IEEE Open Access
 Publication in Conference proceedings/Workshop Lumen maintenance prediction for LEDs – new insights.  Jacobs, B., van Driel, W., & Schuld, M. EuroSimE    2018, Toulouse  doi:http://dx.doi.org/10.1109/EuroSimE.2018.8369895  Open Access
 Publication in Conference proceedings/Workshop Color maintenance prediction for LED-based products. van Driel, W., Beijer, J., Bikker, J., van Blokland, C., Ankomah, C., & Jacobs, B. EuroSimE    2018, Toulouse doi:http://dx.doi.org/10.1109/EuroSimE.2018.8369875 Open Access
Book From Si towards SiC technology for Harsh Environment Sensing L.M. Middelburg, W.D. van Driel, G.Q. Zhang IoSense Book, p. 4-19   2019    
Book Health monitoring for Lighting Applications W.D. van Driel, L.M. Middelburg, B. El Mansouri, B.J.C. Jacobs IoSense Book, p 393-422   2019    
Book Ultraviolet Sensing in WBG – SiC B. El Mansouri, W.D. van Driel, G.Q. Zhang IoSense Book, p. 423-452   2019    

Events and Exhibitions

Description Event Date Location Target Group Photos
“Advanced Packaging of a Micro-Gravity Sensor System: Microsystem Integration from a Hardware Perspective” Henk van Zeijl & Luke Middelburg IoSense Spring School 2018 2018-04-12 Dresden, Germany PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies
“Sensor Integration Developments at TU-Delft”, Kouchi Zhang, IoSense Spring School 2019 2019-03-07 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location Addressed Topic Photos
Eurosim conference Conference 2018-04-15 France Designing a 100 [aF/nm] capacitive transducer  
IEEE conference Conference 2018-10-28 India Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications  

Technische Universität Dresden (TUD)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Publication in Conference proceedings/Workshop Adaptive Petri Nets – A Petri Net Extension for Reconfigurable Structures Carl Mai, René Schöne, Johannes Mey, Thomas Kühn, Uwe Aßmann ADAPTIVE 2018 18.02.-22.02.2018 Barcelona, Spain IARA XPS Press Open Access
Publication in Conference proceedings  Design and Concept of an Osmotic Analytics Platform based on R Container Dominik Grzelak, Johannes Mey, Uwe Aßmann Proceedings of the 2018 International Conference on Foundations of Computer Science (FCS’18) 06/09/2018 2018 CSREA Press / ISBN: 1-60132-476-6 Open Access
Publication in Conference proceedings Towards a Software Architecture for Near Real-Time Applications of IoT D. Grzelak, C. Mai, and U. Aßmann 4th International Conference on Internet of Things, Big Data and Security (IoTBDS) 21/02/2019 2019    
Book A Software Toolkit for Complex Sensor Systems in Fog Environments Dominik Grzelak, Carl Mai, René Schöne, Jan Falkenberg, Uwe Aßmann IoSense Book, p. 274-305   2019    
Publication in Conference proceedings Cross-Layer Adaptation in Multi-layer Autonomic Systems (Invited Talk) Uwe Aßmann, Dominik Grzelak, Johannes Mey, Dmytro Pukhkaiev, René Schöne, Christopher Werner, Georg Püschel SOFSEM 2019: Theory and Practice of Computer Science 11 January 2019 Nový Smokovec, 2019 Springer International Publishing, Pages 1-20, ISBN 978-3-030-10801-4 Open Access

Events and Exhibitions

Description Event Date Location Target Group Photos
Meeting of the new Silicon Saxony e. V. working group “Smart Systems & Internet of Things”. Presentations were given under the topic: “Digitalization in Practice” Arbeitskreistreffen Silicon Saxony e. V. at T-Systems Multimedia Solutions GmbH June 25, 2018 Dresden, Germany Industry leader, network, exchange ideas  
Attending auditorium: Industry and Academia. The Tenth International Conference on Adaptive and Self-Adaptive Systems and Applications 2018 (ADAPTIVE) 18.02.-22.02.2018 Barcelona, Spain Industry and Academia  
Mobile World Congress is the world’s largest gathering for the mobile industry, organised by the GSMA. Mobile World Congress 27.02.-02.03.2017 Barcelona, Spain Industry leaders gather, network, showcase, and exchange ideas.  
BCW is an annual event that celebrates the Internet of Things. Through inspiring keynotes, three session tracks, a huge IoT exhibition, a Meet Up stage, a hackathon, and a lot networking opportunities, the attendees can learn how the Bosch ConnectedWorld experience, and especially IoT, is truly remarkable. Bosch Connected World (BCW) 15.03.-16.03.2017 Berlin, Germany    
Industrial exhibition, which is one of the world’s leading trade shows for consumer electronics and home appliances. Internationale Funkausstellung (IFA) 01.09.-06.09.2017 Berlin, Germany consumer electronics retailer, public and media  
Topics are digitalisation and its impact on society and economy. Target groups: management of the local economy Darwin Circle 08.09.2017 Vienna, Austria public administration and media
Recently, IEEE Communications Society has developed a strategic framework based on the principles that embrace Industry’s interests and priorities while integrating IEEE and ComSoc’s objectives. In order to engage industry members with high value and innovative technologies, IEEE Communications Society plans to hold a series of high impact one day summits in emerging technology areas (e.g., SDN/NFV, 5G, IoT, Big Data, and Cybersecurity). IEEE 5G Summit 19.09.2017 Dresde, Germany industry leaders, innovators, and researchers from the industry and academic  
Demonstration Infineon Internal – INNO Spring 2017 May 16th 2017 Dresden, Germany    
“Workshop session on IoT Ecosystems – Customer Centric Lean Innovation Process” Prof. Dr. Uwe Aßmann & Carl Mai IoSense Spring School 2018 12.04.2018 Dresden, Germany PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies
“A Software Toolkit for Complex Sensor Systems in Fog Environments”, Thang Phan IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Graz University of Technology (TUG)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Publication in Conference proceedings/Workshop SecureConfig: NFC and QR-Code based Hybrid Approach for Smart Sensor Configuration. Thomas Ulz, Thomas Pieber, Christian Steger, Christian Lesjak, Holger Bock, Rainer Matischek IEEE RFID 2017 09.05.-11.05.2017 Phoenix, AZ, USA, 2017 IEEE Open Access
Publication in Conference proceedings/Workshop Bring Your Own Key for the Industrial Internet of Things Thomas Ulz, Thomas Pieber, Christian Steger, Sarah Haas, Holger Bock, Rainer Matischek IEEE ICIT 2017 22.3-25.3.2017 Toronto, Canada IEEE Open Access
Publication in Conference proceedings/Workshop Secured and Easy-to-Use NFC-Based Device Configuration for the Internet of Things   IEEE Journal of Radio Frequency Identification 2017 2017 IEEE DOI: 10.1109/JRFID.2017.2745510 Open Access
Publication in Conference proceedings/Workshop Hardware-Secured Configuration and Two-Layer Attestation Architecture for Smart Sensors Thomas Ulz, Thomas Pieber, Christian Steger, Sarah Haas, Holger Bock, Rainer Matischek Euromicro DSD 2017 30.08.-01.09.2017 Vienna, Austria IEEE Open Access
Publication in Conference proceedings/Workshop  Hardware Secured, Password-based Authentication for Smart Sensors for the Industrial Internet of Things  Thomas Pieber, Thomas Ulz, Christian Steger, Rainer Matischek  NSS 2017 21.8-23.8.2017 Helsinki, Finnland Springer ISBN: 978-3-319-64700-5, DOI: 10.1007/978-3-319-64701-2_50 Open Access
Paper SystemC Test Case Generation with the Gazebo Simulator Thomas Pieber, Thomas Ulz, Christian Steger Proceedings of the 7th International Conference on Simulation and Modeling Methodologies, Technologies and Applications 2017 2017 SciTePress ISBN: 978-989-758-265-3, DOI: 10.5220/0006404800650072 Open Access
Paper Sneakernet on Wheels: Trustworthy NFC-based Robot to Machine Communication   Proceedings of the 2017 IEEE International Conference on RFID Technology & Application (RFID-TA) 2017 2017 IEEE DOI: 10.1109/RFID-TA.2017.8098906 Open Access
Publication in Conference proceedings/Workshop Automated Credential Derivation for the Secured Configuration of Devices in the Internet of Things Thomas Ulz, Thomas Pieber, Christian Steger, Andrea Höller, Sarah Haas, Rainer Matischek IEEE 20.09.-22.09.2017 Warsaw, Poland IEEE  
Journal IEEE Journal of Radio Frequency Idenfitication Thomas Ulz, Thomas Pieber, Andrea Hoeller, Sarah Haas, Christian Steger IEEE Transactions on Industrial Informatics     IEEE Open Access
Paper Using Gazebo to Generate Use Case Based Stimuli for SystemC   Advances in Intelligent Systems and Computing 2019 2019 Springer ISBN: 978-3-030-01469-8, DOI: 10.1007/978-3-030-01470-4_13 Open Access
Paper Towards Trustworthy Data in Networked Control Systems: A Hardware-Based Approach   Proceedings of the 2017 IEEE International Conference on Emerging Technologies and Factory Automation (ETFA). 2017 2017 IEEE DOI: 10.1109/ETFA.2017.8247636 Open Access
Paper QSNFC: Quick and Secured Near Field Communication for the Internet of Things   IEEE RFID 2018 2018 IEEE DOI: 10.1109/RFID.2018.8376190 Open Access
Paper Secured Remote Configuration Approach for Industrial Cyber-Physical Systems   IEEE ICPS 2018 2018 IEEE DOI: 10.1109/ICPHYS.2018.8390811 Open Access
Paper Automated Authentication Credential Derivation for the Secured Configuration of IoT Devices   IEEE SIES 2018 2018 IEEE DOI: 10.1109/SIES.2018.8442106 Open Access
Paper Time-of-Flight Cameras for Parking Assistance: A Feasibility Study Steinbaeck, J., Druml, N., Tengg, A., & Steger, C. H. ASDAM 2018, (pp. 215-218). Smolenice.   2018 doi:http://dx.doi.org/10.1109/ASDAM.2018.8544683 Open Access
Paper Secured Multi-Purpose Near Field Communication Interface for Robots using Components off the Shelf Ulz, T., Pieber, T., Steger, C., Haas, S., & Matischek, R. IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2018) [NOT YET PUBLISHED]. 2018, Madrid    
Book Model-based Design of Secured Power Aware Smart Sensors Thomas Wolfgang Pieber, Thomas Ulz, and Christian Steger IoSense Book, p. 247-273   2019    

Event and Exhibitions

Description Event Date Location Target Group Photos
The International Conference on Advanced Semiconductor Devices and Microsystems ASDAM 2018 devoted to the latest results of research and development in the field of new semiconductor devices and microsystems. Its goal was to bring together leading experts from institutes and universities as well as companies interested in the progress of high technology devices and microsystems. ASDAM 2018 The 12th International Conference on Advanced Semiconductor Devices and Microsystems 21.10 – 24.10.2018 Bratislava, Slovakia leading experts from institutes and universities  
“TrustworSys – Towards Trustworthiness for IoT Sensors” Thomas Pieber, TU Graz IoSense Spring School 2018 12.04.2018 Dresden, Germany PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies
“Security Concepts Applied in the TrustWorSys Demonstrator”, Thomas Ulz IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location Addressed Topic Photos
  Symposium on Industrial Embedded Systems 06.06.18-08.06.18 Graz Automated Authentication Credential Derivation for the Secured Configuration of IoT Devices  
  IEEE RFID 10.04.18-12.04.18 Orlando QSNFC: Quick and Secured Near Field Communication for the Internet of Things  
  IEEE International Conference on Industrial Cyber-Physical Systems 10.05.18-12.05.18 St. Petersburg Secured Remote Configuration Approach for Industrial Cyber-Physical Systems  
  IEEE International Conference on Industrial Technology 22.03.17-25.03.17 Toronto Bring Your Own Key for the Industrial Internet of Things  
  RFID Technology and Applications 20.09.17-22.09.17 Warsaw Sneakernet on Wheels: Trustworthy NFC-based Robot to Machine  
  22nd IEEE International Conference on Emerging Technologies And Factory Automation 12.09.17-15.09.17 Limassol Towards Trustworthy Data in Networked Control Systems: A Hardware-Based Approach  
  IEEE International Conference on RFID 09.05.17-11.05.17 Phoenix SecureConfig: NFC and QR-Code based Hybrid Approach for Smart Sensor Configuration  
  Euromicro Digital System Design 30.08.17-01.09.17 Vienna Hardware-Secured Configuration and Two-Layer Attestation Architecture for Smart Sensors  
  SIMULTECH 2017 26.07.17-18.07.17 Madrid SystemC Test Case Generation with the Gazebo Simulator  
  11th International Conference on Network and System Security (NSS-2017) 21.08.17-23.08.17 Helsinki Hardware Secured, Password-based Authentication for Smart Sensors for the Industrial Internet of Things  

Alpen-Adria-Universität Klagenfurt (UNI-KLU)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Scientific Publication Optimal Design of Angular Position Sensors Hubert Zangel, Lisa-Marie Faller and Wolfgang Granig          
Scientific Publication Sensor System Optimization to meet Reliability Targets. Granig, W., Faller, L.-M., & Zangl, H.  Microelectronics Reliability.    2018  doi:http://dx.doi.org/10.1016/j.microrel.2018.06.005  
Scientific Publication Calculation of Failure Detection Probability on Safety Mechanisms of Correlated Sensor Signals According to ISO 26262. Granig, W., Hammerschmidt, D., & Zangl, H. SAE International Journal of Passenger Cars – Electronic and Electrical Systems, 144-155   2017  https://doi.org/10.4271/2017-01-0015  Open Access
Scientific Publication Wireless differential pressure measurement for aircraft. Leitzke, J. P., Mea, A. D., Faller, L.-M., Mühlbacher-Karrer, S., & Zangl, H. Elsevier Measurement, 459-465.   2018 doi:10.1016/j.measurement.2017.12.042  
Scientific Publication Automatic Integration of Transducers in ROS via Transducer Electronic Data Sheets. Mitterer, T., & Zangl, H. IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2018) [NOT YET PUBLISHED]. 2018    
Scientific Publication Considerations on Solar Energy Harvesting for Smart Systems. Della Mea, A., Padilha Leitzke, J., & Zangl, H. Proceedings Smart System Integration 2018   Auersbach: Wissenschaftliche Scripten. 2018   Open Access
Scientific Publication Transducer Electronic Data Sheets on Smart Ultra Low Power Devices Mitterer, T., & Zangl, H. Smart Systems Integration. [NOT YET PUBLISHED]. Dresden, 2018    
Book Sensor System Optimization under Uncertainty Wolfgang Granig, Lisa-Marie Faller, Hubert Zangl IoSense Book, p. 306-339   2019    

Event and Exhibitions

Description Event Date Location Target Group Photos
Conference paper “Automatic Integration of Transducers in ROS via Transducer Electronic Data Sheets” IEEE/RSJ International Conference on Intelligent Robots and Systems 2018 (IROS) 01.10.-05.10.2018 Madrid, Spain Industry and Academia  
Smart Systems Integration brings together experts in smart systems and their applications from all over Europe. The event is an ideal business and networking platform for systems integration of miniaturized components and knowledge-sharing and discussions at the highest level. Smart Systems Integration 11.04.-12.04.2018 Dresden, Germany Industry and Academia.  

Virtual Vehicle (VIF)

Publications

Type Title Author Title of the Journal/Proceedings/Book Date of Acceptance Place/Year of publication Publisher/ISBN Repository Link/Open Access
Book Sensor testing for Smart Mobility scenarios: From Parking Assistance to Automated Parking J. Murgoitio Larrauri, E.D. Martí Muñoz, M.E. Vaca Recalde, B. Hillbrand, A. Tengg, Ch. Pilz, N. Druml IoSense Book, p 355-392   2019    
Paper Time-of-Flight Cameras for Parking Assistance: A Feasibility Study Josef Steinbaeck, Norbert Druml, Allan Tengg, Christian Steger, and Bernhard Hillbrand ASDAM 2018 10-2018 2018 DOI: 10.1109/ASDAM.2018.8544683 Open Access
Paper Car parking assistance based on Time-of-Flight camera Luis Paarup Pelaez, Myriam E. Vaca Recalde, Enrique D. Martı Munoz, Jesus Murgoitio Larrauri, Joshue M. Perez Rastelli, Norbert Drumland Bernhard Hillbrand 10th IAV 2019 (Intelligent Autonomous Vehicles) In progress 2019 IEEE  

Events and Exhibitions

Description Event Date Location Target Group Photos
The International Conference on Advanced Semiconductor Devices and Microsystems ASDAM 2018 devoted to the latest results of research and development in the field of new semiconductor devices and microsystems. Its goal was to bring together leading experts from institutes and universities as well as companies interested in the progress of high technology devices and microsystems. ASDAM 2018 The 12th International Conference on Advanced Semiconductor Devices and Microsystems 21.10 – 24.10.2018 Bratislava, Slovakia Leading experts from institutes and universities  
VIF demonstrator car with the Time-of-Flight cameras was shown European Forum Alpbach 23.-25.08.2018 Alpbach Technology Companies  

Workshop and Conferences

Description Event Date Location Addressed Topic Photos
Paper Presentation together with IFAT ASDAM 2018 2018-10-24 Smolenice Time-of-Flight Cameras for Parking Assistance: A Feasibility Study  

Small and Medium Enterprise (SME)

Advanced Packaging Center B.V. (APC)

Events and Exhibitions

Description Event Date Location Target Group Photos
“Selective over-molding of a CMOS TSV wafer with flexible integration of components and sensors” 19th Electronics Packaging Technology Conference 05-08.12.2017 EPTC, Singapore Semicon / electronic industry and universities.  

Boschman Technologies B.V. (BTE)

Events and Exhibitions

Description Event Date Location Target Group Photos
“Selective over-molding of a CMOS TSV wafer with flexible integration of components and sensors” 19th Electronics Packaging Technology Conference 05-08.12.2017 EPTC, Singapore Semicon / electronic industry and universities.  

Födisch Umweltmesstechik AG (FOEDISCH)

Events and Exhibitions

Description Event Date Location Target Group Photos
During the projects session on the second day, an IoSense project overview and a poster with general, public content will be presented by the Coordinator as well as a fine-dust-sensor demonstrator together with partner FOEDISCH. ECSEL Germany Congress 05.09.-06.09.2018 Dresden, Germany Organisations and partners involved in current ECSEL projects.  
“Detecting Particles – Make it Simple by a new Fine Dust Sensor”, Jörg Schulz, Head of R&D IoSense Spring School 2018 12.04.2018 Dresden, Germany PhD students, industrial designers, technology scouts and project managers with basic programming knowledge and an interest in sensor-based technologies

Materialforschung und Anwendungstechnik GmbH (IMA)

Events and Exhibitions

Description Event Date Location Target Group Photos
European industrial trade fair for quality control, measuring technologies and sensor equipment. Control 2018 24.04.-27.04.2018 Stuttgart, Germany industrial customers and quality engineers, retailer, public and media  
World’s leading Industrial trade show for whole wind energy branch, including measuring and sensor equipment. WindEnergy 2018 25.09.-28.09.2018 Hamburg, Germany industrial customers, developing engineers, investors, public and media
Industrial trade fair for production and automation technology. Our focus on contacts for testing, measuring and sensor equipment. INTEC 2019 05.02.-08.02.2019 Leipzig, Germany industrial customers, developing and quality engineers, investors, public and media  

Integrasys SA (INTEGRASYS)

Events and Exhibitions

Description Event Date Location Target Group Photos
The European Forum for Electronics Components and Systems organizes Face 2Face meetings as an unique networking opportunity event. EFECS event December 4-6th, 2017 Brussels, Belgium Actors in the ICT sector & Electronic Components and Systems value chain
The European Forum for Electronics Components and Systems organizes Face 2Face meetings as an unique networking opportunity event. EFECS event November 20 – 22th, 2018 Lisbon, Portugal Actors in the ICT sector & Electronic Components and Systems value chain  
“Smability: Reliable V2X communication”, Jose Cordero, Cristina Rodiguez IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies
Poster “Real-time Dynamic Local Map (DLM) generation for driving assistance using only LiDAR data. Application to a co-simulation traffic scenario” IoSense Spring School 2019 07.03.2019 Delft, Netherlands PhD students, industrial designers, technology scouts and project managers and an interest in sensor-based technologies

Workshop and Conferences

Description Event Date Location Addressed Topic Photos
Technical talks will focus on the innovations and technologies achieved during the project. Talks will be accompanied by demo presentations that will show how the technologies, developed within the IoSense project, can be used in real life application areas. 2nd IoSense Spring School 2019-03-07 TU Delft, Netherlands Demo about Smability: Reliable V2X Communication  

Iquadrat Informatica S.L. (IQU)

Events and Exhibitions

Description Event Date Location Target Group Photos
 Stand at the Smart Cities Expo World Congress SCEWC 2018 13-15.11.2018 Barcelona Smart Cities  
Stand at the IoT Solutions World Congress (IoTSWC) 2017  3-5 October 2017  Barcelona  
 Stand at the Smart Cities Expo World Congress  SCEWC 2017  14-16 November 2017  Barcelona    
Worldwide leading Event for smart cities Smart City Expo World Congress 2016 (SCEWC) 15.11.-17.11.2016 Barcelona Governments and public administration, public or private institutions, research and academia, global companies, small and medium enterprises, start-ups and entrepreneurs  

POWERTEC (PTEC)

Workshop and Conferences

Description Event Date Location Addressed Topic Photos
Presentation “Internet of things and smart mobility” Martin Donoval, Director of R&D projects, POWERTEC ltd Semicon Europa 2018 TechARENA November 15, 2018   Internet of things  

XENON Automatisierungstechnik GmbH (XENON)

Workshop and Conferences

Description Event Date Location Addressed Topic Photos
Presentation SEMICON 2018-11-13 Munic Mounting of magnets in speed sensor assembly