Virtual Prototyping for Shortest Time-to-Market of New IoT Products (Focus: Design for Reliability)
Speaker: Prof. Sven Rzepka, Fraunhofer Institute for Electronic Nano Systems ENAS, Germany
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IoT from the Perspective of a Sensor Company
Speaker: Ewald Wachmann, Senior Manager – ams AG, Austria
Ewald Wachmann is Senior Manager Device R&D at ams AG. He has been working in the semiconductor industry for more than 30 years and worked at Siemens, Villach (now Infineon) before he joined ams AG. His current responsibilities cover the development and integration of advanced analog CMOS and sensor devices including 3D integration. He holds a Master of Science degree in Physics from the Technical University of Graz, Austria and is a Senior member of IEEE. He has authored or co-authored more than 30 technical papers, holds three patents and is lecturing at Carinthia University of Applied Sciences. He has managed and coordinated several European and national funded research projects in the last years for technology and sensor development and integration.
Innovative Process Chains for Sensors
Speaker: Horst Theuss, Lead Principal – Infineon Technologies Regensburg, Germany
Pilotlines for MEMS and sensors represent the core of the IoSense project. These lines are based upon existing semiconductor production comprising both wafer technology (Frontend) and packaging (Backend). IoSense targets to establish various line extensions in order to adapt existing production to the needs of MEMS and sensors.
The presentation introduces the respective line extensions and explains how the various activities are embedded into the overall project. An overview over targeted prototypes is given, comprising magnetics, pressure sensors, MEMS microphones, gas sensors and Radar applications.
A specific concept for a miniaturized MEMS microphone and its implementation into a Fan Out Wafer Level Package line will be specifically discussed. This example represents the most innovative and ambitious concept within the Infineon pilot line approaches.
From Parking Assistance to Automated Parking using a Time-Of-Flight Camera
Speaker: Jesus Murgoitio, Project Manager – Tecnalia, Spain
U.S. regulation requires all new manufactured vehicles to integrate a rear camera for visual feedback on reversing (i.e. driving backwards). Innovative sensing technologies as time-of-flight cameras combine light intensity information of classical video systems with accurate depth perception. This makes possible to go from basic visual feedback (video image) to advanced parking assistance (obstacle detection and warning) and even automated parking with a single sensor. In this use case we explore the capabilities and limitations of time-of-flight technology applied to automated driving/parking.
Advanced Packaging of a Micro-Gravity Sensor System: Microsystem Integration from a Hardware Perspective
Speaker: Luke Middelburg, TU Delft, Netherlands
In this work the system integration aspects and the packaging design and process of the novel designed micro-gravity sensor will be discussed. A resonator fabricated in a 300um bulk micromachined silicon wafer exhibiting an extremely low resonance frequency functions as the basis for the high sensi-tivity accelerometer. The movements of this resonator will be read-out using a interdigitated structure, also obtained by bulk micromachining. The die will be wirebonded on a standard DIP package, in order to obtain a working system with the ability for field tests. Variable separation distances between the reso-nating mass and the package results in adjustable air squeeze film damping. Covering the outer part of the die with a Pyrex die enables redundant optical measurements. Future work includes integration of the bare silicon die of the impedance read-out ASIC, as well as the usage of glass dies with waterjet cut-ted holes, through which wire bonding can take place.
TrustworSys – Towards Trustworthiness for IoT Sensors
Speaker: Thomas Pieber, TU Graz, Infineon Technologies Austria AG, Austria
The trustworthiness of sensors on the Internet of Things, so-called smart sensors, is massively influenced by the capability to configure and reconfigure these sensors. Recent attacks successfully demonstrated that smart sensors often are secured by default login credentials. Also, outdated configurations lead to security issues, and thus, negatively influence the trustworthiness of such sensors. Therefore, in this talk, we are going to present novel methods that facilitate the secured configuration and reconfiguration of smart sensors during their entire lifecycle. Since such a secured configuration approach requires security considerations at all levels, we are not only going to present solutions at protocol level but also demonstrate hardware architectures that integrate dedicated security hardware such as security controllers.
Detecting Particles – Make it Simple by a new Fine Dust Sensor
Speaker: Jörg Schulz, Head of R&D – Dr. Födisch Umweltmesstechnik AG, Germany
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Passive RFID Sensors – Battery-Free, Wireless Pressure Measurements
Speaker: Dr. Andreas Weder, Team Manager of Module Integration Group – Fraunhofer Institute for Photonic Microsystems (IPMS)
Wireless sensor systems are key technologies for the Internet of Things (IoT). They are used to measure physical parameters like temperature, pressure or humidity in many industrial environments. One possible solution for these measurements is the application of RFID sensor transponders. RFID sensor transponders combine extremely energy efficient sensors with standard RFID protocols. Passive transponders harvest the complete energy for measurement and communication from the electromagnetic field of the RFID reader. Due to the lack of cable connections or an integrated battery, these sensor transponders can be mounted in difficult to reach positions (e.g. inside machines, encapsulated into compound materials, within or on rotating elements, etc.). Therefore, such sensor systems can be operated for many years without expensive maintenance procedures. The talk will introduce the general concept, show advantages, limitations and the use case of battery-free, wireless pressure sensors, based on the Back-End-of-Line (BEoL) integration of a sensor element on top of the CMOS circuit.